PCB Layer Stackup for Target-Band Power Noise Blocking

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Solution Overview

Problem

Existing electronic devices face challenges in reducing power noise, particularly in target frequency bands, which can negatively impact the performance of components like communication modules due to the design limitations of printed circuit boards (PCBs).

Innovation Solution

The implementation of a PCB layout that includes a first signal layer, a ground layer, a second signal layer, and dielectrics with specific thicknesses and permittivities, along with a length pattern, to effectively block power noise in a target frequency band without the need for additional noise-reducing components like decoupling capacitors.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If a conventional PCB design is used, then the device structure is simple, but power noise is emitted to the external environment

Engineering Contradiction:
Improvepower noiseVSAvoidPCB structure
Core Design Contradiction:
Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The PCB is divided into multiple functional layers including first and second signal layers, first and second ground layers, and dielectric layers. Each layer serves a specific function in noise reduction, with signal layers for data transmission, ground layers for noise shielding, and dielectric layers for insulation and capacitance control, collectively blocking power noise in target frequency bands

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different regions of the PCB are designed with specific characteristics: signal layers have controlled impedance for high-speed data transmission, ground layers provide noise shielding, and dielectric layers offer insulation and capacitance. Each layer's properties are optimized for its specific function to reduce power noise while maintaining signal integrity

Inventive Principle:
Principle #3Local quality

2Object-affected harmful factors

If additional noise-reducing components are added, then power noise is reduced, but device complexity and cost increase

Engineering Contradiction:
Improvepower noiseVSAvoidnumber of components
Core Design Contradiction:
Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The PCB layers serve multiple functions simultaneously. For example, ground layers provide both electrical grounding and electromagnetic shielding, while dielectric layers provide both insulation and capacitance for noise filtering. This multi-functionality reduces power noise without requiring separate dedicated noise-reducing components

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The PCB structure itself provides noise reduction functionality through its layered configuration. The ground layers and dielectric layers work together to block power noise in target frequency bands, making the PCB self-sufficient for noise reduction without requiring additional external components

Inventive Principle:
Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration reduces power noise by optimizing impedance and capacitance, resulting in lower impedance and reduced electromagnetic field radiation, thereby enhancing the performance of electronic components without additional noise-reducing components.

Implementation Method 1

a first dielectric positioned between the first ground plate and the second signal plate and having a first thickness and a first permittivity, a second dielectric positioned between the second signal plate and the second ground plate and having a second thickness and a second permittivity corresponding to the second parameter

Methodology Applied
Scientific EffectDielectric permittivity: Dielectric Permittivity

Data Source

PatentUS20240431020A1Printed circuit board for reducing power noise and electronic device including the same
Publication Date: 2024.12.26 SAMSUNG ELECTRONICS CO LTD
  • US20240431020A1 patent drawing
  • US20240431020A1 patent drawing
  • US20240431020A1 patent drawing

AI summary

An electronic device according to an example embodiment includes a printed circuit board (PCB) configured to connect a first electronic component and a second electronic component and block power noise in a target frequency band. The PCB may include a first signal layer including a first signal plate having a length pattern with a length corresponding to a first parameter of the target frequency band, a first ground layer including a first ground plate with a first area, a second signal layer including a second signal plate, a first dielectric having a first thickness and a first permittivity, a second ground layer including a second ground plate with a second area corresponding to a second parameter of the target frequency band, and a second dielectric having a second thickness and a second permittivity corresponding to the second parameter.