Automated PCB Stencil Manufacturing via Database Query
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Solution Overview
Problem
The existing methods for PCB stencil manufacturing are cumbersome, time-consuming, and prone to errors, requiring manual checks and complex processes, which lead to inefficiencies and high chances of missing openings, especially when dealing with large numbers of elements.
Innovation Solution
A method and system for PCB stencil manufacturing that involves inputting design information in a preset format, converting it into system core data, querying a stencil opening database based on solder pad element patterns and coordinates, and automatically generating stencil opening patterns, reducing manual intervention and increasing accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If manual checking and processing methods are used for PCB stencil manufacturing, then flexibility and adaptability are maintained, but manufacturing efficiency is low and error rate is high
Solution Approach 1:
The patent replaces manual mechanical checking and processing with an automated computer-based system that uses image recognition and data processing algorithms to automatically generate stencil opening patterns, thereby eliminating human error and significantly improving both efficiency and accuracy
Solution Approach 2:
The system enables self-service by automatically processing Gerber files and generating stencil opening patterns without requiring manual intervention, allowing the manufacturing process to serve itself through automated detection and pattern generation
2Productivity
If automated processing is implemented for PCB stencil manufacturing, then manufacturing efficiency and accuracy are improved, but system complexity increases
Solution Approach 1:
The patent implements a universal system that can handle multiple PCB design formats (Gerber files, CAD files) and automatically perform multiple functions including image processing, pattern recognition, and stencil generation, thereby managing complexity through multi-functionality rather than multiple separate systems
Solution Approach 2:
The system uses an intermediary database structure to store and manage the relationship between PCB design data and stencil opening patterns, serving as a mediator that simplifies the complexity of direct processing by organizing data in a structured, queryable format
3Loss of time
If manual processing steps are reduced, then manufacturing time is shortened, but risk of errors may increase
Solution Approach 1:
By replacing manual mechanical operations with automated computer-based processing, the system eliminates the trade-off between speed and accuracy, as the automated system can operate rapidly while maintaining high accuracy through algorithmic precision
Solution Approach 2:
The system incorporates feedback mechanisms that automatically verify the generated stencil opening patterns against the original PCB design data, ensuring accuracy is maintained even as processing steps are reduced and automation increases
Data Source
AI summary
A PCB stencil manufacturing method and system. The method comprises: inputting PCB stencil design information in a preset input format, the PCB stencil design information comprises solder pad element information; and converting the PCB stencil design information into corresponding system core data information, the system core data information comprises solder pad element packaging information, and the solder pad element packaging information comprises a solder pad element packaging pattern and solder pad element coordinates; and querying a stencil opening database according to the solder pad element packaging pattern, records in the stencil opening database comprise the following attributes: a solder pad element packaging pattern and a stencil opening pattern; and placing a stencil opening pattern corresponding to a matching solder pad element packaging pattern to an opening layer according to the solder pad element coordinates.