Printed Wiring Board Stepped Conductor Adhesion
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Solution Overview
Problem
Printed wiring boards face challenges in increasing the number of wiring conductors to meet the growing functionality of electronic components, requiring more insulating layers and efficient electrical connections while maintaining structural integrity and reducing stress.
Innovation Solution
A printed wiring board design featuring multiple laminated insulating layers with wiring conductors and through-hole conductors, where the first surface of the wiring conductor is positioned outside the central axis of the through hole, enhancing adhesion strength and reducing shear stress by increasing the contact area between the through-hole conductor and the insulating layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the number of insulating layers is increased to secure more wiring conductor formation regions, then the number of wiring conductors can be increased, but the structural complexity and manufacturing difficulty increase
Solution Approach 1:
The patent positions the wiring conductor surface outside the insulating layer surface in the thickness direction, creating a stepped configuration. This dimensional arrangement allows the through-hole conductor to contact both the wiring conductor and insulating layer simultaneously, enabling effective electrical connection without requiring additional insulating layers, thus increasing wiring density without proportionally increasing structural complexity.
Solution Approach 2:
The through-hole conductor is positioned to extend into the through hole while contacting both the wiring conductor and insulating layer, creating a nested arrangement where the through-hole conductor serves multiple functions (electrical connection, mechanical support, stress distribution) within a single structural element, reducing the need for additional components.
2Strength
If traditional through-hole conductor positioning is used (centered in the through hole), then manufacturing is simpler, but adhesion strength is insufficient and shear stress is higher
Solution Approach 1:
The patent creates a localized stepped configuration where the wiring conductor surface extends beyond the insulating layer surface only in the regions where through-hole conductors are positioned. This local quality change ensures that the through-hole conductor contacts both the wiring conductor and insulating layer for maximum adhesion strength, while maintaining simpler manufacturing in other regions of the printed wiring board.
Data Source
AI summary
The printed wiring board of the present disclosure includes: a plurality of insulating layers laminated in a thickness direction; a plurality of wiring conductors respectively correspondingly positioned between the plurality of insulating layers; a through hole penetrating the plurality of insulating layers and the plurality of wiring conductors in the thickness direction; and a through-hole conductor positioned on a wall surface of the through hole; each of the plurality of wiring conductors has a first surface facing the through hole, each of the plurality of insulating layers has a second surface facing the through hole, and the first surface is farther away from a central axis penetrating the through hole in the thickness direction than the second surface.