PCB Strain Gauge Network for Thermal Stress Monitoring
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Solution Overview
Problem
Current printed circuit boards face challenges in predicting mechanical and thermal behavior accurately, leading to reliability issues due to inaccurate digital simulations and high manufacturing costs, with existing methods failing to effectively monitor mechanical deformations and thermal stresses.
Innovation Solution
Incorporating a strain gauge network into printed circuit boards to measure mechanical deformations, allowing for real-time monitoring and data collection on physical carrier function evolution, which can be used to improve design reliability and detect issues such as incorrect mounting or abnormal thermal stresses, and enabling adaptive adjustments to reduce heat-induced thermal expansion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of time
If digital simulation means are used to predict thermal behavior, then design time is reduced, but measurement precision and reliability of predictions deteriorate
Solution Approach 1:
The patent implements feedback by using strain gauges to continuously monitor actual mechanical deformations and thermal expansion of the PCB during operation. This real-world data feeds back into the design process, allowing validation and refinement of digital simulation models, thereby improving prediction accuracy while maintaining efficient design cycles.
Solution Approach 2:
The PCB incorporates self-monitoring capabilities through integrated strain gauges that automatically measure its own mechanical and thermal behavior during operation. This self-service approach provides accurate empirical data without requiring external testing equipment or interrupting normal operation, resolving the contradiction between quick design iteration and accurate measurement.
2Measurement precision
If actual tests on prototypes are conducted, then measurement precision improves, but productivity and design time deteriorate
Solution Approach 1:
The strain gauges are pre-installed on the PCB during manufacturing, performing preliminary measurement setup. This allows continuous monitoring to begin immediately upon operation without requiring separate prototype testing phases, thereby maintaining high productivity while achieving accurate measurement data.
Solution Approach 2:
The monitoring system enables continuous data collection during normal PCB operation rather than requiring discontinuous prototype testing. This continuous useful action provides comprehensive measurement data throughout the product lifecycle without interrupting production or design workflows, resolving the contradiction between test accuracy and design throughput.
3Reliability
If strain gauges are added to monitor deformations, then reliability improves, but device complexity increases
Solution Approach 1:
The strain gauge network serves multiple functions: monitoring mechanical deformations, measuring thermal expansion, validating simulation models, and providing diagnostic data. This multi-functionality justifies the added complexity by delivering comprehensive reliability information from a single integrated system rather than requiring separate monitoring solutions for each function.
Solution Approach 2:
The monitoring function is merged directly into the PCB structure through integrated strain gauges that become part of the carrier itself. This combining of monitoring capabilities with the structural component reduces overall system complexity compared to adding separate external monitoring equipment, while still achieving improved reliability through continuous deformation measurement.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances the reliability and repairability of printed circuit boards by providing valuable data for design improvements and fault diagnostics, reducing manufacturing costs and extending service life by monitoring and managing mechanical and thermal stresses.
Implementation Method 1
it comprises a strain gauge... The mechanical deformations observed in the printed circuit board may be saved
Implementation Method 2
the heat possibly released by the components... abnormal thermal stresses... heat-induced thermal expansion
Data Source
AI summary
A printed circuit board including electronic components, a carrier equipped with a network of conductor tracks electrically connecting the electronic components, and a plurality of strain gauges positioned on the carrier such that each one of the plurality of corners has a respective one of the plurality of strain gauges positioned closer to the one of the plurality of corners than to any other of the plurality of corners.