PCB Strip Dummy Die Warping Prevention
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Solution Overview
Problem
Conventional printed circuit boards experience warping phenomena due to thickness differences between insulating layers, particularly in component-embedded designs and printed circuit board strips, which complicates manufacturing and automation processes.
Innovation Solution
Incorporating a dummy die in the outer regions of the printed circuit board and printed circuit board strip, made from materials like semiconductor, ceramic, or organic/inorganic composite materials, to maintain structural rigidity and minimize thickness discrepancies between insulating layers, with the dummy die occupying at least 30% of the outer region's area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the thickness of the upper insulating layer and the thickness of the lower insulating layer are equally adjusted by adjusting the thicknesses of the insulating materials, then the thickness uniformity is improved, but a difference between the thicknesses of the region in which the cavity is formed and the other region in the upper insulating layer occurs, causing warping phenomenon
Solution Approach 1:
The patent applies local quality by introducing dummy dies specifically in the outer region where no real die is disposed. This creates a localized structural enhancement that compensates for the thickness difference between the cavity region and outer region, preventing warping without affecting the overall design. The dummy die is disposed at a specific location (outer region) to address the local thickness imbalance.
2Productivity
If a printed circuit board strip is manufactured with real die disposed only in the central region, then productivity is improved through unified strip structure, but a difference between the thicknesses of the insulating layers occurs in the outer region, causing severe strip wrapping phenomenon
Solution Approach 1:
The patent introduces dummy dies in the outer region of the printed circuit board strip to locally compensate for the thickness difference caused by the absence of real dies. This localized structural enhancement prevents strip wrapping phenomenon while maintaining the unified strip structure for high productivity.
Solution Approach 2:
The dummy die is essentially a copy or replica of the real die structure, designed to mimic its mechanical support function without containing the actual functional components. This allows the outer region to have the same structural characteristics as the central region, preventing warping and wrapping phenomena.
3Stability of the object's composition
If dummy die is disposed in the outer region, then warping phenomenon is minimized and structural integrity is improved, but device complexity increases
Solution Approach 1:
The dummy die is a simplified copy of the real die structure, containing only the essential mechanical support features without the complex functional components of a real die. This reduces the complexity increase while still achieving the warping prevention objective.
Data Source
AI summary
A printed circuit board according to an embodiment comprises: a first insulation layer; a plurality of first cavities formed in the central region of the first insulation layer; a plurality of second cavities formed in the outer region of the first insulation layer, excluding the central region; real dies respectively disposed in the plurality of first cavities; dummy dies respectively disposed in the plurality of second cavities; a second insulation layer formed on the first insulation layer and filling the first cavities and the second cavities; and a third insulation layer disposed beneath the first insulation layer, wherein the real dies comprise substantial driving elements and the dummy dies do not comprise the driving elements.