Multilayer PCB Subarea Integration via Prepreg Lamination
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Solution Overview
Problem
The challenge lies in producing a printed circuit board with multilayer subareas without encountering issues such as aligning and connecting subareas with existing multilayer boards, which can be complex and costly, especially when integrating four-layer subareas with two-layer boards.
Innovation Solution
The method involves applying a dielectric insulating layer and conducting paths to a conducting foil, interposing a prepreg layer, and laminating under pressure and heat, with additional prepreg layers used to align and connect multiple conducting foils, allowing for the creation of throughplatings by drilling and filling holes with conducting material.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If subareas are mechanically or electrically connected on lateral surfaces with adhesive and curing, then the printed circuit board can be produced with multilayer subareas, but the production process becomes complex and costly with alignment issues
Solution Approach 1:
The printed circuit board is divided into multiple subareas that can be produced separately and then connected. Each subarea can be manufactured independently using standard PCB processes, and the segmentation allows for modular assembly reducing overall production complexity
Solution Approach 2:
A connecting structure with interlocking elements serves as an intermediary between subareas. The connecting structure includes engagement features that mechanically link subareas together, providing both mechanical support and electrical connectivity without requiring complex adhesive alignment processes
2Ease of operation
If subareas are joined by leaving a distance and connecting subsequently with adhesive, then subareas can be mechanically connected, but extensive cutting and alignment processes are required
Solution Approach 1:
The connecting structure is designed with pre-formed interlocking elements that engage with corresponding features on subareas. The engagement features are prepared in advance during PCB manufacturing, eliminating the need for time-consuming alignment and cutting operations during assembly
Solution Approach 2:
The adhesive bonding process is replaced with a mechanical interlocking system. The connecting structure features geometric engagement elements that provide automatic alignment and secure mechanical connection, substituting the complex adhesive application and curing process with a simpler mechanical assembly operation
3Adaptability or versatility
If four-layer subareas are integrated with two-layer boards, then multilayer functionality is achieved, but the integration process becomes complex and costly
Solution Approach 1:
Different subareas are designed with different layer configurations (four-layer or two-layer) according to their specific functional requirements. The connecting structure provides localized adaptation, allowing high-density four-layer subareas to be integrated with simpler two-layer subareas through the standardized mechanical and electrical interface
Solution Approach 2:
The connecting structure serves multiple functions simultaneously: it provides mechanical support, electrical connectivity, and alignment registration. This multi-functionality allows different layer configurations to be integrated through a single universal connection mechanism, reducing integration complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the cost-effective production of printed circuit boards with multilayer subareas, ensuring precise alignment and electrical connectivity while maintaining a smooth surface and flexibility, reducing the need for extensive cutting and alignment processes.
Implementation Method 1
laminating the parts joined in step d) under pressing force and heat
Implementation Method 2
laminating the parts joined in step d) under pressing force and heat
Implementation Method 3
laminating the parts joined in step d) under pressing force and heat
Data Source
Figure 1a~1c
Figure 2a~2d
Figure 3~5
AI summary
A method for producing a printed circuit board (13, 15, 16) with multilayer subareas in sections, characterized by the following steps: a) providing at least one conducting foil (1, 1') and application of a dielectric insulating foil (3, 3') to at least one subarea of the conducting foil; b) applying a structure of conducting paths (4, 4') to the insulating layer (3, 3'); c) providing one further printed circuit board structure; d) joining of the further printed circuit board structure with the conducting foil (1, 1') plus insulating layer (3, 3') and conducting paths (4, 4') by interposing a prepreg layer (5, 85; 18, 18'), and e) laminating the parts joined in step d) under pressing pressure and heat; and a printed circuit board produced according to this method.