Substrate for Printed Wiring Board with Embedded Metal Nanoparticles
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Solution Overview
Problem
The challenge in creating a substrate for printed wiring boards is the formation of irregularities during thermocompression bonding, which hinders the creation of fine conductive patterns due to inadequate adhesiveness between the substrate and the metal nanoparticle layer.
Innovation Solution
A substrate comprising a base material layer with a thermoplastic resin, a metal nanoparticle layer, and a plating layer, where some metal nanoparticles in the nanoparticle layer are embedded in the base material layer, enhancing adhesiveness and allowing for the formation of fine conductive patterns.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If thermocompression bonding is used to attach metal foil to resin film, then the substrate can be formed, but irregularities are formed on the metal foil surface which hinder fine conductive pattern formation
Solution Approach 1:
The invention changes the bonding parameters by using hot pressing at 80-120°C for 1-24 hours, which is different from conventional thermocompression bonding. This temperature and time parameter optimization prevents irregularity formation on the metal nanoparticle layer surface while achieving adequate adhesiveness, thereby enabling fine conductive pattern formation
Solution Approach 2:
The invention uses a metal nanoparticle layer instead of conventional metal foil. The metal nanoparticle layer can be replaced and regenerated more easily, and its fine particle structure allows for better surface uniformity after bonding, resolving the contradiction between ease of manufacture and manufacturing precision
2Volume of moving object
If densification of substrate is implemented to reduce device size, then device size is reduced, but conductive patterns become finer and more prone to peeling
Solution Approach 1:
The invention creates a composite structure consisting of a resin film layer and a metal nanoparticle layer. The metal nanoparticle layer acts as an intermediate layer that enhances the bond strength between conductive patterns and the substrate. This composite material approach allows for substrate densification while maintaining or improving adhesiveness, as the nanoparticle layer provides mechanical interlocking and increased surface area for bonding
Solution Approach 2:
The invention changes the physical state and distribution parameters of the metal layer by using nanoparticles instead of continuous foil. The nanoparticle morphology provides increased surface area and mechanical interlocking capability, which enhances adhesiveness even when the substrate is densified and conductive patterns are made finer
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration achieves excellent adhesiveness, as evidenced by a 180-degree peel strength of 5 N/cm or more, preventing the conductive pattern from peeling off and enabling the formation of fine conductive patterns on the substrate.
Implementation Method 1
there has been proposed a base member formed by attaching a metal foil to a resin film by hot pressing (thermocompression bonding) or the like
Data Source
AI summary
A substrate for a printed wiring board according to the present disclosure includes: a base material layer containing a thermoplastic resin; a metal nanoparticle layer, and a plating layer. The base material layer, the metal nanoparticle layer, and the plating layer are stacked in this order, and some of metal nanoparticles in the metal nanoparticle layer are embedded in the base material layer.