PCB Support Frame Structure for Lower-Waste Board Assembly
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Solution Overview
Problem
The production of printed circuit boards (PCBs) contributes significantly to CO₂ emissions and material waste due to non-sustainable materials and manufacturing processes, and there are limited alternatives that can withstand physical demands and environmental conditions.
Innovation Solution
A system comprising an electronic circuit board with a carrier plate and a mounting frame, where the frame contacts the circuit board's edge to at least 50% of its circumference, made from materials like metals, plastics, or biodegradable plastics, allowing for decoupled design and flexible manufacturing, including 3D printing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If traditional PCB materials and manufacturing processes are used, then manufacturing capability and electrical functionality are achieved, but CO2 emissions and material waste increase significantly
Solution Approach 1:
The system divides the PCB assembly into separate functional components: the carrier plate (PCB) and the mounting frame. This segmentation allows the carrier plate to be minimized to only the essential functional area while the mounting frame provides the remaining structural support and mechanical functions, reducing overall material usage and CO2 footprint.
Solution Approach 2:
The mounting frame is extracted as a separate component from the traditional PCB structure. This extraction removes the non-functional material portions from the carrier plate itself, allowing it to be made as small as possible while maintaining electrical functionality, with the mounting frame taking over the mechanical support role.
2Loss of substance
If PCB size is reduced to minimize material usage, then material waste and CO2 footprint decrease, but the ability to withstand physical demands and environmental conditions deteriorates
Solution Approach 1:
By segmenting the system into carrier plate and mounting frame, the functional requirements are distributed differently: the carrier plate only needs to be large enough for electronic components (minimizing material), while the mounting frame provides the mechanical protection and environmental resistance through its separate structural design.
Solution Approach 2:
The system uses composite construction combining the carrier plate material (for electrical functionality) with mounting frame material (for mechanical strength and environmental resistance). This composite approach allows each component to be optimized for its specific function rather than requiring the entire PCB to meet all requirements.
3Stability of the object's composition
If mounting frame contacts carrier plate at greater than or equal to 50% circumference, then mechanical stability and electrical connection improve, but manufacturing complexity increases
Solution Approach 1:
The mounting frame serves multiple functions simultaneously: it provides mechanical support, electrical connection, and structural stability through its circumferential contact with the carrier plate. This multi-functionality is achieved through a simple geometric design that contacts at 50% or more of the circumference, avoiding complex fastening mechanisms while achieving stable assembly.
Data Source
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AI summary
The present invention relates to a system comprising an electronic printed circuit board and a support frame for receiving the printed circuit board.