PCB Support Layer Curvature for Fine Circuit Pattern Stability
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional circuit boards with fine circuit patterns at the outermost portion are prone to collapse due to lack of support, and the bonding force between the support insulating layer and solder resist is inadequate, leading to reliability issues, especially in high-frequency applications like 5G communication systems.
Innovation Solution
A circuit board structure featuring a support insulating layer with a curved upper surface and a protective layer that exposes the circuit pattern, along with a primer layer to enhance bonding, is designed to stabilize the outer layer circuit patterns, using a sand blasting process to control the surface shape and improve contact area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a conventional flat support insulating layer is used, then the structure is simple and easy to manufacture, but the bonding force between the support insulating layer and solder resist is inadequate
Solution Approach 1:
The support insulating layer is designed with a curved upper surface instead of a flat surface. This curvature increases the surface area and improves the bonding force between the support insulating layer and the solder resist layer, directly resolving the technical contradiction between bonding strength and structural simplicity.
2Productivity
If the circuit pattern is made fine to increase integration, then the degree of circuit integration increases, but the circuit pattern at the outermost portion easily collapses
Solution Approach 1:
The curved upper surface of the support insulating layer provides better mechanical support and distribution of stress, preventing the collapse of fine circuit patterns at the outermost portion while maintaining high circuit integration.
Solution Approach 2:
The support insulating layer has different surface characteristics at different locations - the curved upper surface provides enhanced support where needed, while other regions maintain their conventional structure. This localized quality improvement allows fine circuit patterns to be supported without requiring complete structural redesign.
3Productivity
If the circuit line width is reduced to meet nanometer scale design rules, then more circuits can be integrated, but loss during etching increases
Solution Approach 1:
The support insulating layer with curved surface is prepared in advance before the circuit pattern formation process. This preliminary structural preparation provides a stable foundation that prevents circuit line width loss during subsequent etching operations, allowing high-density integration without compromising pattern integrity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed structure enhances the reliability of fine circuit patterns by preventing collapse and improving bonding force, minimizing transmission loss in high-frequency applications, thereby supporting the integration and performance of 5G communication systems.
Implementation Method 1
using a sand blasting process to control the surface shape and improve contact area
Data Source
AI summary
A printed circuit board according to an embodiment comprises: an insulating layer; a circuit pattern disposed on the upper surface of the insulating layer; a support layer which is disposed on the upper surface of the insulating layer to expose the upper surface of the circuit pattern and is in contact with the sides of the circuit pattern; and a protective layer disposed on the upper surfaces of the support layer and the circuit pattern, wherein the upper region of the insulating layer comprises a first region and a second region, and the protective layer comprises an open region exposing the upper surfaces of the support layer and the circuit pattern that are disposed in the first region, and the support layer comprises a first upper surface positioned at the highest level among the upper surfaces of the support layer and a second upper surface positioned at the lowest level among the upper surfaces of the support layer, the second upper surface being lower than the first upper surface, and the protective layer comprises a first portion which contacts the upper surface of the circuit pattern of the first region and a second portion which contacts the upper surface of the support layer of the first region, and the second portion of the protective layer contacts the second upper surface of the support layer and includes a first lower surface which is lower than the upper surface of the circuit pattern.