PCB Support Layer Thermal Conductivity via Embedded Filler
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Solution Overview
Problem
The challenge is to effectively manage heat in compact electronic equipment without increasing size, mass, or complexity, as existing methods like metallic heat sinks and active cooling often fail to efficiently dissipate heat in restricted spaces.
Innovation Solution
A printed circuit board (PCB) with a fibre-reinforced epoxy support layer embedded with thermally conductive and electrically insulating filler powder, such as ceramic powders like boron nitride, which enhances thermal conductivity without adding bulk, allowing for passive heat dissipation through the PCB itself and into ambient air.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If metallic heat sinks are attached to PCBs to absorb and dissipate heat, then heat dissipation capability is improved, but device complexity and assembly complexity increase
Solution Approach 1:
The patent merges the heat dissipation function with the PCB support layer itself by embedding thermally conductive filler powder directly into the epoxy resin matrix. This integration eliminates the need for separate metallic heat sinks and their associated mounting hardware, thereby reducing assembly complexity while maintaining heat dissipation capability.
Solution Approach 2:
The support layer is designed to perform multiple functions simultaneously: providing mechanical support for the circuit layer and acting as a thermal management component through its embedded thermally conductive filler powder. This multi-functionality reduces the overall component count and assembly complexity.
2Temperature
If active cooling components are directly connected to electrical components to increase heat dissipation, then heat dissipation capability is improved, but device complexity and power consumption increase
Solution Approach 1:
The PCB support layer performs heat dissipation passively through its inherent thermal conductivity enhanced by the embedded filler powder. This self-service approach eliminates the need for active cooling components such as fans or pumped cooling systems, thereby reducing device complexity and power consumption.
3Temperature
If cooling measures are added to improve heat dissipation, then heat dissipation capability is improved, but size and mass increase
Solution Approach 1:
By integrating the thermally conductive filler powder directly into the support layer, the heat dissipation function is combined with the existing structural component. This eliminates the need for additional separate cooling components that would increase mass, as the cooling capability is achieved within the existing PCB structure.
4Temperature
If thermally conductive filler powder is embedded in the support layer to improve heat dissipation, then heat dissipation capability is improved, but manufacturing complexity increases
Solution Approach 1:
The patent modifies the thermal conductivity parameter of the support layer by incorporating thermally conductive filler powder into the epoxy resin matrix. This parameter change is achieved through standard composite material manufacturing processes, which do not significantly increase manufacturing complexity while effectively improving heat dissipation capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution improves thermal management by reducing temperatures and evenly distributing heat across the PCB, eliminating the need for bulky heat sinks and active cooling components, thus maintaining equipment functionality in space-constrained applications.
Implementation Method 1
the support layer comprises a fibre-reinforced epoxy layer having a thermally conductive and electrically insulating filler powder embedded therein
Implementation Method 2
the second side of the printed circuit board, which is opposite to the first side, comprises cooling fins configured to exchange heat with ambient air
Data Source
Figure 1~2
Figure 3
AI summary
There is provided a printed circuit board 2 comprising a circuit layer 8 comprising an electrical conductor for conducting electricity through the printed circuit board 2 and a support layer 10 for supporting the circuit layer 8. The support layer 10 comprises a fibrereinforced epoxy layer 12 having a thermally conductive and electrically insulating filler powder 14 embedded therein. The support layer 10 has a thermal conductivity of at least 1 W/m. K.