PCB Support Members for Impact Protection

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Solution Overview

Problem

Existing electronic devices face challenges in protecting printed circuit boards from external impacts, as current supporting structures are inadequate in preventing damage to both the first and second printed circuit boards when subjected to external forces.

Innovation Solution

The electronic device incorporates a first and second support member on each printed circuit board, with an interposer between them, where the support members are designed to come into contact upon external force application, thereby reducing the risk of damage by spacing and supporting each other.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a supporting structure is added to protect printed circuit boards from external impact, then the reliability of the printed circuit boards is improved, but the device complexity increases

Engineering Contradiction:
Improveprotection of printed circuit boardsVSAvoidstructure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The support members are disposed within the spaces between electronic components on the printed circuit boards, nesting the protective structure within the existing device architecture rather than adding external structures. This allows the support members to protect the PCBs without significantly increasing overall device complexity

Inventive Principle:
Principle #7Nested doll (Nesting)

Solution Approach 2:

The support members act as intermediary elements between the electronic components and the external impact forces. These intermediaries absorb and distribute impact forces, protecting the vulnerable PCBs while maintaining a relatively simple overall structure

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If support members are disposed close to electronic components to maximize protection, then the protection effectiveness is improved, but the risk of contact between support members and electronic components increases

Engineering Contradiction:
Improveprotection effectivenessVSAvoidcontact between support members and electronic components
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The support members are positioned at specific locations between electronic components rather than uniformly distributed. This local positioning strategy provides targeted protection in areas most vulnerable to impact while maintaining sufficient spacing to avoid contact with electronic components during normal operation

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The support members are designed to contact each other only when necessary (under external impact), rather than maintaining constant contact. This partial action approach provides protection exactly when needed while avoiding interference with electronic components during normal device operation

Inventive Principle:
Principle #16Partial or excessive action

3Reliability

If the length of support members is increased to improve spacing and protection, then the protection capability is improved, but the device volume increases

Engineering Contradiction:
Improvespacing and protection capabilityVSAvoiddevice volume
Core Design Contradiction:
ReliabilityVSVolume of moving object

Solution Approach 1:

The support members are nested within the existing space between the first and second printed circuit boards, utilizing unused volume in the device architecture. This allows increased support member length for better protection without proportionally increasing the overall device volume

Inventive Principle:
Principle #7Nested doll (Nesting)

Solution Approach 2:

The support members extend in the vertical dimension between the two PCBs rather than expanding the horizontal footprint of the device. This dimensional approach provides enhanced protection capability while maintaining a compact device form factor

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS20240422911A1Electronic device including supporting structure for printed circuit board
Publication Date: 2024.12.19 SAMSUNG ELECTRONICS CO LTD
  • US20240422911A1 patent drawing
  • US20240422911A1 patent drawing
  • US20240422911A1 patent drawing

AI summary

According to an embodiment, an electronic device includes a first printed circuit board and a second printed circuit board, facing the first printed circuit board, disposed over the first printed circuit board. The electronic device includes a first support member disposed on a first surface of the first printed circuit board. The electronic device includes a second support member, disposed on a second surface of the second printed circuit board, facing the first printed circuit board and configured to come into contact with the first support member by an external force applied to the electronic device. The electronic device includes an interposer between the first printed circuit board and the second printed circuit board, surrounding an area between the first surface and the second surface.