3D Printed PCB Support Block With Targeted Vacuum Channels

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Solution Overview

Problem

Current support blocks for printed circuit board assemblies (PCBAs) face issues with optimal surface flatness, dimensional tolerances, weight, and inefficient vacuum application, particularly for boards with components on both sides, leading to increased production costs and ergonomic concerns.

Innovation Solution

A 3D printed support block with a single piece design, featuring a bottom surface with a vacuum connection, a top surface with vacuum holes, and recessed surfaces with offset vacuum channels, providing improved flatness, reduced weight, and targeted vacuum distribution.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Weight of moving object

If traditional aluminum support blocks are used, then structural strength is adequate, but weight is excessive causing ergonomic issues and higher shipping costs

Engineering Contradiction:
Improvesupport block weightVSAvoidstructural strength
Core Design Contradiction:
Weight of moving objectVSStrength

Solution Approach 1:

The support block incorporates a porous internal structure with vertical channels and cavities that reduce material usage and weight while maintaining structural integrity. The porous design allows vacuum to penetrate through the block efficiently while keeping the overall weight manageable for ergonomic handling.

Inventive Principle:
Principle #31Porous materials

Solution Approach 2:

The support block is constructed from composite materials combining rigid external walls for structural strength with porous internal structures for weight reduction. This composite approach allows the block to maintain adequate strength for supporting PCBAs while significantly reducing weight compared to solid aluminum blocks.

Inventive Principle:
Principle #40Composite materials

2Adaptability or versatility

If two-block design with cut-outs is used, then component accommodation is improved, but dimensional tolerance and flatness deteriorate due to accumulated tolerances

Engineering Contradiction:
Improvecomponent accommodationVSAvoiddimensional tolerance and flatness
Core Design Contradiction:
Adaptability or versatilityVSManufacturing precision

Solution Approach 1:

The invention merges the top block and bottom block into a single integrated support block structure. This eliminates the interface between two separate blocks, thereby eliminating accumulated dimensional tolerances and ensuring superior flatness across the entire support surface while maintaining the ability to accommodate components through internal porous structures.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The support block features localized porous structures and cut-outs at specific positions to accommodate components, while maintaining a flat external surface. The local quality variation allows component accommodation without compromising overall dimensional tolerance and flatness of the support block.

Inventive Principle:
Principle #3Local quality

3Productivity

If uniform vacuum distribution is used, then simplicity is maintained, but vacuum efficiency deteriorates for large or complex PCBAs

Engineering Contradiction:
Improvevacuum application efficiencyVSAvoidvacuum distribution system
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The vacuum distribution system is segmented into multiple vertical channels and cavities within the porous structure, allowing vacuum to be distributed to different regions of the support block simultaneously. This segmented approach improves vacuum application efficiency for large or complex PCBAs while maintaining relative simplicity through the integrated porous design.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The vacuum distribution transitions from a two-dimensional surface approach to a three-dimensional volumetric approach through the porous internal structure. Vacuum is distributed through vertical channels and cavities throughout the volume of the support block, enabling efficient vacuum application to PCBAs of various sizes and complexities.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The 3D printed support block achieves better flatness, reduced weight, and more efficient vacuum application, minimizing dimensional tolerances and production costs while enhancing ergonomic safety and manufacturing efficiency.

Implementation Method 1

a bottom surface having a vacuum connection; a top surface having at least one vacuum hole; and at least one vacuum channel extending from the vacuum connection to the at least one vacuum hole

Methodology Applied
Scientific EffectVacuum: Vacuum

Data Source

PatentUS11785754B2Enhanced 3D printed support block
Publication Date: 2023.10.10 JABIL INC
  • US11785754B2 patent drawing
  • US11785754B2 patent drawing
  • US11785754B2 patent drawing

AI summary

Support blocks for printed circuit boards (PCB's) and printed circuit board assemblies (PCBA's), wherein the support blocks are produced from a 3D printing process. The support block including a bottom surface having a vacuum connection; a top surface having at least one vacuum hole; at least one recessed surface that is offset from the top surface; and at least one vacuum channel extending from the vacuum connection to the at least one vacuum hole.