PCB Tape Heat Spreader Protrusions to Prevent Adhesive Contamination
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Adhesive contamination occurs during the rolling and transportation of printed circuit board tapes due to stress-induced squeezing, affecting both the tape and protection tape, and reuse of contaminated protection tapes leads to further contamination.
Innovation Solution
A tape manufacturing method that includes forming separation protrusions on a heat spreader using a die device to prevent adhesive movement, combined with a protection tape to separate stacked tapes and prevent contamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a protection tape is used to protect the printed circuit board tape during rolling, then the printed circuit board tape is protected during transportation, but adhesive squeezes out and contaminates both the printed circuit board tape and the protection tape
Solution Approach 1:
The heat spreader is segmented by forming separation protrusions on its surface, creating physical barriers that divide the adhesive layer into separate sections. This segmentation prevents the adhesive from flowing continuously and squeezing out during rolling, thus eliminating contamination while maintaining the protective function.
Solution Approach 2:
The separation protrusions act as intermediary structures between the adhesive layer and the protection tape. These protrusions create air gaps and physical barriers that prevent direct contact between the adhesive and the protection tape, thereby preventing contamination while allowing the protection tape to fulfill its protective role.
2Stability of the object's composition
If stress is applied to the printed circuit board tape and protection tape during rolling, then the tapes are compacted for transportation, but the adhesive is squeezed out causing contamination
Solution Approach 1:
The separation protrusions segment the adhesive layer, creating multiple small compartments instead of a continuous layer. This segmentation allows the stacked tapes to be compacted under rolling stress while the adhesive remains confined within each compartment, preventing it from being squeezed out and causing contamination.
Solution Approach 2:
The separation protrusions create local variations in the heat spreader surface, forming raised regions that locally contain the adhesive. This local quality change allows the adhesive to be held in specific locations, preventing it from moving and contaminating adjacent tapes during the rolling and transportation process.
Data Source
AI summary
A manufacturing method of tape includes the steps of providing a tape including substrate units, providing a die device and a cutting and/or pressing process. Each of the substrate units includes a carrier, a circuit layer, an adhesive and a heat spreader, the heat spreader is attached onto the carrier by the adhesive. In the cutting and/or pressing process, the die device is provided to press the tape to generate separation protrusions on the heat spreader and allow the separation protrusions to protrude from a heat dissipation surface of the heat spreader. When rolling the tape, the separation protrusions can separate the stacked substrate units to prevent the adhesive from being squeezed out to contaminate the tape.