PCB TEM Waveguide Interconnect for Contactless High-Rate Data Transfer
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Solution Overview
Problem
Existing wireless data transfer systems between electronic device components, particularly between printed circuit boards, face challenges such as high losses, low data rates, large size, high complexity of fabrication, and strong dependence on the quality of conductive element contacts, failing to meet requirements for compactness, reliability, and cost-effectiveness.
Innovation Solution
A wireless data transfer system utilizing a transverse electromagnetic (TEM) mode waveguide formed by alternating conductive metal layers with electromagnetic band gap (EBG) structures on printed circuit boards, enabling efficient conversion between signal transmission and TEM modes, with reflectors and guides to maintain signal directionality and minimize leakage, allowing for high data rates without mechanical contact.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional galvanic interconnect methods (SMD connectors or RF connectors) are used for PCB-to-PCB data transfer, then mechanical connection and signal transmission are achieved, but the system suffers from sensitivity to mechanical and thermal stresses, misalignment issues, contact reliability problems, and requirement for precise assembly with minimum distance maintenance
Solution Approach 1:
The patent replaces the mechanical galvanic contact system with a wireless electromagnetic field-based communication system. The transmitter and receiver units communicate through electromagnetic waves without physical contact, eliminating sensitivity to mechanical stresses, thermal expansion, and alignment issues while maintaining reliable data transfer between PCBs
Solution Approach 2:
The patent introduces electromagnetic waves as an intermediary medium for data transmission between PCBs. Instead of direct mechanical contact between connectors, the wireless system uses electromagnetic fields to carry information across the gap between transmitter and receiver units, resolving the contradiction between reliability and assembly complexity
2Productivity
If wireless radio communication (NFC) is used for data transfer, then contactless communication is achieved, but the system experiences narrow bandwidth, low data rate (up to 2.1 Mbit/s), and requires ferrite shielding that increases space
Solution Approach 1:
The patent changes the operating parameters of the wireless system by using higher frequency electromagnetic waves and optimized antenna designs in the transmitter and receiver units. This enables significantly higher data rates compared to NFC while eliminating the need for bulky ferrite shielding through improved electromagnetic field confinement and directional communication
3Reliability
If optical wireless communication is used for data transfer, then high data rate is achieved, but the system requires direct view between transmitter and receiver, complex beam control mechanics, and precise tuning that increases space and losses
Solution Approach 1:
The patent replaces the complex mechanical beam control system required by optical communication with an electromagnetic wave-based wireless system. The transmitter and receiver units use electromagnetic fields that naturally propagate through air without requiring direct line of sight or complex mechanical adjustment mechanisms, simplifying the system while maintaining signal stability
4Productivity
If existing wireless techniques are adapted to millimeter wavelength range for high-rate data transfer, then data rate improvement is achieved, but the systems become either too expensive, too cumbersome, or require isolation and precise mechanical assembly
Solution Approach 1:
The patent divides the wireless communication system into separate transmitter and receiver units that can be independently manufactured and then integrated. Each unit contains its own antenna, circuitry, and housing, allowing for standardized mass production and simplified assembly compared to monolithic designs, thereby improving ease of manufacture while maintaining high data rates
Solution Approach 2:
The patent designs universal transmitter and receiver units that can be applied to various PCB configurations and applications. The modular design with standardized interfaces and electromagnetic coupling mechanisms allows the same basic units to serve multiple functions and be manufactured using common processes, reducing fabrication complexity and cost
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system achieves high data transmission rates, enhanced reliability, and reduced complexity with a compact design, facilitating easier assembly and lower fabrication costs by eliminating the need for precise mechanical alignment and external shielding.
Implementation Method 1
form a transverse electromagnetic (TEM) mode waveguide
Implementation Method 2
a second part of the printed circuit board comprising an EBG (electromagnetic band gap) structure
Data Source
AI summary
The present disclosure relates generally to radio engineering, and for example, to high-rate wireless data transfer between different printed circuit boards or between parts of the same printed circuit board. The technical result is easier fabrication, smaller dimensions, lower losses at high frequencies and improved performance. According to the disclosure, a wireless data transfer system comprises: two printed circuit boards separated by an air gap, between which a transverse electromagnetic (TEM) mode waveguide is formed, wherein each printed circuit board includes a converter structure configured to: perform conversion between the signal transmission line mode and TEM mode in the waveguide, connected to an RF component; wherein the converter structure includes: an antenna, a signal transmission line between the antenna and the RF component, and at least one reflector configured to provide directive propagation of the TEM mode in the waveguide; wherein the width of the air gap between the printed circuit boards does not exceed λ/4, where λ is the wavelength of the transmitted signal.