Temperature Sensor Placement for PCB Thermal Monitoring
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Solution Overview
Problem
Existing memory modules cannot effectively detect temperature variations in regions between semiconductor memory and control units on a printed circuit board, especially when components other than the memory package act as heat sources or have higher temperatures than the memory package.
Innovation Solution
An information processing apparatus with a nonvolatile semiconductor storage device that includes a printed circuit board, a nonvolatile semiconductor memory, a memory controller, and a temperature sensor positioned between the memory and the controller to detect temperature within the storage device, with the memory controller at the upstream side of the air flow and the temperature sensor at the downstream side.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the temperature sensor is positioned to detect the memory package temperature, then the memory package temperature can be measured, but the temperature of other components or regions with higher temperature cannot be detected
Solution Approach 1:
The temperature sensor is positioned at a specific location between the memory package and control unit where the highest temperature occurs. This localized positioning ensures that the sensor measures the critical high-temperature region rather than the memory package itself, enabling accurate detection of the hottest spot in the system.
Solution Approach 2:
The patent changes the spatial dimension of temperature detection by moving the sensor from detecting the memory package temperature to detecting the temperature in the region between the memory package and control unit. This dimensional shift in sensor placement allows detection of previously undetectable high-temperature areas.
2Adaptability or versatility
If multiple temperature sensors are added to detect different regions, then comprehensive temperature coverage is achieved, but device complexity and cost increase
Solution Approach 1:
The patent extracts only the essential temperature detection function by placing a single sensor at the critical high-temperature region between the memory package and control unit. This selective approach eliminates the need for multiple sensors while still achieving effective thermal monitoring of the most critical area.
Solution Approach 2:
The patent uses a simple, inexpensive temperature sensor positioned strategically to detect the highest temperature region. This single sensor provides cost-effective thermal monitoring compared to implementing multiple sensors throughout the system, achieving adequate coverage with minimal hardware investment.
3Ease of manufacture
If the air flow direction is not considered in sensor positioning, then the sensor can be placed anywhere, but the temperature measurement does not reflect the actual thermal environment
Solution Approach 1:
The patent incorporates air flow direction considerations into the sensor positioning design from the outset. The sensor is pre-positioned in the region between the memory package and control unit, which is identified as the high-temperature zone considering the air flow pattern from the cooling fan. This preliminary consideration ensures accurate temperature measurement without requiring post-manufacturing adjustments.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables accurate temperature measurement of regions with higher temperatures than other areas on the printed circuit board, improving thermal management and reducing manufacturing costs by efficiently positioning temperature sensors.
Implementation Method 1
a cooling fan that suctions open air into the main unit to cool inside the main unit with an air flow
Implementation Method 2
a temperature sensor that is mounted on the printed circuit board and detects temperature within the nonvolatile semiconductor storage device
Data Source
AI summary
An information processing apparatus may include a housing, a board accommodated inside the housing, a plurality of memories mounted on the board, a temperature sensor mounted on the board to be adjacent to one of the memories, and a memory controller mounted on the board to be adjacent to the temperature sensor and configured to acquire temperature information detected by the temperature sensor. The temperature sensor may be mounted on a central portion of the board so as to be positioned between one side of the memory controller and one side of the one of the memories. Other embodiments are also described.