PCB Connection Terminal Corner Sharpness via Resist Protection
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing manufacturing process for printed circuit board connection terminals results in rounded corners, reducing the bonding area and weakening the connection reliability, especially as printed circuit boards become finer.
Innovation Solution
The printed circuit board features connection terminals with a radius of curvature not larger than 35 μm, formed using a method that includes forming etching resist patterns to prevent corner rounding during the etching process, ensuring a stronger bond between the terminals and electronic components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional etching process is used to form connection terminals, then manufacturing process is simple, but corner roundness occurs reducing bonding area and connection reliability
Solution Approach 1:
The patent applies preliminary action by forming a protective resist film on the connection terminal corners before the etching process. This resist film is applied in advance to prevent corner roundness from occurring during etching, thereby maintaining sharp corners and ensuring adequate bonding area for reliable connections.
Solution Approach 2:
The patent uses a resist film as an intermediary substance between the etching solution and the connection terminal corners. This intermediary layer protects the corners from the etching solution, preventing the harmful rounding effect while allowing the rest of the terminal to be properly formed.
2Length of moving object
If printed circuit boards are made finer, then miniaturization is achieved, but bonding area of connection terminals is reduced due to corner roundness
Solution Approach 1:
The resist film is applied in advance to the connection terminal corners before etching, preventing corner roundness from occurring. This preliminary protective action ensures that even as boards are miniaturized, the bonding area is preserved by maintaining sharp corners throughout the manufacturing process.
Solution Approach 2:
The patent changes the physical state and properties of the resist material by controlling its application thickness and etching resistance characteristics. By adjusting these parameters, the resist film provides adequate protection against corner roundness while allowing precise control over the final terminal dimensions, enabling miniaturization without bonding area loss.
3Manufacturing precision
If connection terminals are made smaller, then finer printed circuit boards are achieved, but bond strength weakens due to reduced bonding area
Solution Approach 1:
By applying the protective resist film before etching, the patent ensures that connection terminals maintain sharp corners throughout the manufacturing process. This preliminary protection allows terminals to be made smaller with higher precision while preserving adequate bonding area, thereby maintaining bond strength even as terminal size is reduced for finer circuit boards.
Solution Approach 2:
The patent optimizes the resist film parameters (thickness, etching resistance) to enable precise formation of small connection terminals with sharp corners. By carefully controlling these parameters, the process maintains adequate bonding area in miniaturized terminals, preserving bond strength while achieving the required manufacturing precision for fine-pitch circuits.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the connection reliability and allows for the production of finer printed circuit boards by minimizing the reduction in bonding area due to corner rounding, thereby improving the bond strength between the connection terminals and magnetic heads.
Implementation Method 1
part of the metal substrate that is exposed on the resist pattern is etched
Data Source
AI summary
A read wiring trace and a write wiring trace are formed on an insulating layer. Connection terminals made of conductor are connected to the read wiring trace and the write wiring trace, respectively. Each connection terminal has at least one corner with a radius of curvature of not larger than 35 μm.