PCB Test Pin Width Layout for Incorrect Fastening Detection
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Solution Overview
Problem
Existing electronic devices face challenges in reliably sensing incorrect fastening connections between printed circuit boards, which can lead to reduced connectivity and operational reliability.
Innovation Solution
The electronic device incorporates a design where the test pins on the printed circuit boards are wider than signal and power pins, providing increased rigidity and ensuring proper contact even under pressure, thus enhancing the ability to detect incorrect fastening.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If test pins have the same width as signal and power pins, then the printed circuit board structure is simple and uniform, but the test pins lack sufficient rigidity and may deform under pressure, reducing sensing reliability
Solution Approach 1:
The patent applies local quality by making test pins wider than signal and power pins. This localized dimensional change provides enhanced rigidity specifically where needed (at the test pin location) to prevent deformation under pressure, while other pins maintain their original dimensions. This resolves the contradiction by improving sensing reliability through targeted structural modification without requiring complete redesign of all terminals.
2Reliability
If test pins are made wider to increase rigidity, then the reliability of detecting incorrect fastening improves, but the manufacturing precision requirements increase due to different pin widths
Solution Approach 1:
The patent applies parameter changes by modifying the width dimension of test pins relative to signal and power pins. This dimensional parameter change enhances rigidity and improves incorrect fastening detection reliability. The patent addresses the manufacturing precision challenge by establishing clear width relationships (test pin width > signal pin width and test pin width < power pin width) that provide design guidance for manufacturing while maintaining sufficient differentiation for reliable sensing.
3Ease of manufacture
If all pins have uniform width, then manufacturing is simpler and more cost-effective, but test pins cannot maintain consistent contact under pressure, reducing connectivity reliability
Solution Approach 1:
The patent applies local quality by making test pins wider than signal and power pins. This localized dimensional change provides enhanced rigidity specifically where needed (at the test pin location) to prevent deformation under pressure, while other pins maintain their original dimensions. This resolves the contradiction by improving sensing reliability through targeted structural modification without requiring complete redesign of all terminals.
Data Source
AI summary
An electronic device includes a display panel, a first printed circuit board arranged in a second direction with the display panel, and electrically connected to the display panel, a second printed circuit board adjacent to a first side of the first printed circuit board opposed to a second side thereof adjacent to the display panel in the second direction, and a connection part including a connection cable connecting the first printed circuit board and the second printed circuit board. The first printed circuit board includes a substrate, and terminals disposed on the substrate to be electrically connected to the connection part and the display panel, and including signal pins, power pins, and test pins arranged in a first direction crossing the second direction. A width of the test pin is greater than that of the signal pin, and smaller than that of the power pin in the first direction.