PCB Test Point Layout for Fine-Pitch Connector Miniaturization
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Solution Overview
Problem
Existing methods for forming test points on printed circuit boards result in increased board size due to the use of larger connectors, and the formation of test points that do not fit the pitch interval of smaller connectors, leading to damage and incompatibility with mass production processes.
Innovation Solution
Forming test points and pads on the circuit board with a pitch interval smaller than the standard, allowing for the use of smaller connectors and enabling the test points to be used independently after the connector is removed, with the test points arranged diagonally or in series to maintain the desired pitch.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a separate test board is designed and manufactured for testing each circuit board, then testing can be performed, but the manufacturing process becomes complex and time-consuming
Solution Approach 1:
The invention merges the test board and the actual circuit board into a single integrated structure. The test points are formed directly on the circuit board during the same manufacturing process, eliminating the need for separate test boards. This combining of functions reduces manufacturing complexity while maintaining testing capability.
Solution Approach 2:
The circuit board is designed to serve dual functions: as the operational circuit board and as a test board. The test points are integrated into the circuit board structure itself, allowing the same board to be used for both final product operation and manufacturing testing, thereby eliminating the need for dedicated test fixtures.
2Reliability
If a separate test board is designed and manufactured, then testing can be performed, but production time and costs increase
Solution Approach 1:
By combining the test board functionality with the circuit board itself, the manufacturing process requires only one board production cycle instead of two separate processes. This merging eliminates the additional time and cost associated with manufacturing separate test boards while ensuring testing capability is maintained.
Solution Approach 2:
The test points are formed during the same manufacturing process as the circuit board, specifically during the plating process. This preliminary formation of test points ensures that testing capability is built-in from the start, eliminating the need for subsequent separate test board manufacturing and reducing overall production time.
3Reliability
If test points are formed by plating a separate test board, then testing is enabled, but the process requires additional plating steps
Solution Approach 1:
The invention merges the test point formation process with the main circuit board plating process. Both the circuit board traces and the test points are plated simultaneously in the same plating bath using the same plating solution, eliminating the need for separate plating steps and reducing process complexity.
Solution Approach 2:
The plating process is designed to serve dual purposes: forming the conductive traces of the circuit board and simultaneously forming the test points. This multi-functional plating approach uses a single plating step to achieve both objectives, reducing the number of process steps required.
Data Source
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AI summary
Provided are a method of manufacturing a printed circuit board having test points in which test points and pads are formed on the printed circuit board and then are electrically connected to each other, so that it is possible to form the pads having an interval of a pitch smaller than that in the related art, contribute to miniaturization of the printed circuit board by mounting a connector smaller than that in the related art on the printed circuit board, and use the preformed test points as they are even after the connector used is removed from the printed circuit board, and a printed circuit board manufactured thereby.