High-Frequency Testing Probe Using PCB Traces

Solution Overview

Problem

Conventional high-frequency testing probes are expensive, slow to develop, and sensitive to deviations from tight tolerances, limiting their reliable performance at high frequencies, especially beyond 25 GHz.

Innovation Solution

A high-frequency testing probe design utilizing a printed circuit board (PCB) with probe tips connected through isolated conducting traces, allowing for adjustable orientations and extensions, and housed in a protective enclosure, enabling reliable testing up to 40-70 GHz and beyond.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional cable-based testing probes are used, then reliable testing up to 25 GHz can be achieved, but the probes become expensive, slow to develop, and sensitive to deviations from tight tolerances at higher frequencies

Engineering Contradiction:

Improvetesting reliabilityVSAvoidmanufacturing ease

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent replaces the conventional cable-based mechanical connection system with a printed circuit board (PCB) trace-based electrical connection system. The PCB traces provide a more precise and controllable transmission path for high-frequency signals, reducing sensitivity to mechanical tolerances and enabling reliable operation at frequencies beyond 25 GHz while simplifying the manufacturing process.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the fundamental connection parameter from cable-based mechanical coupling to PCB trace-based electrical coupling. This parameter change enables better control over signal integrity, impedance matching, and frequency response, allowing the probe to maintain reliability at higher frequencies while reducing manufacturing complexity and cost.

Inventive Principle:

Principle #35Parameter changes

2Ease of manufacture

If conventional cable-based testing probes are used, then simple manufacturing can be achieved, but the development time increases and cost increases for high-frequency applications

Engineering Contradiction:

Improvemanufacturing simplicityVSAvoiddevelopment time

Core Design Contradiction:

Ease of manufactureVSLoss of time

Solution Approach 1:

The patent replaces the conventional cable-based mechanical connection system with a printed circuit board (PCB) trace-based electrical connection system. The PCB traces provide a more precise and controllable transmission path for high-frequency signals, reducing sensitivity to mechanical tolerances and enabling reliable operation at frequencies beyond 25 GHz while simplifying the manufacturing process.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Ease of manufacture

If conventional cable-based testing probes are used, then lower cost can be achieved for basic applications, but the frequency range is limited to 25 GHz and below

Engineering Contradiction:

Improvemanufacturing costVSAvoidfrequency range

Core Design Contradiction:

Ease of manufactureVSAdaptability or versatility

Solution Approach 1:

The patent changes the fundamental connection parameter from cable-based mechanical coupling to PCB trace-based electrical coupling. This parameter change enables better control over signal integrity, impedance matching, and frequency response, allowing the probe to maintain reliability at higher frequencies while reducing manufacturing complexity and cost.

Inventive Principle:

Principle #35Parameter changes

Data Source

PatentUS11543434B1High-frequency data differential testing probe

Publication Date: 2023.01.03 SIGNAL MICROWAVE LLC

AI summary

A high-frequency testing probe having a probe substrate and at least two probe tips. The probe substrate is a printed circuit board and the probe tips are coupled to and extend outward from the printed circuit board. The first and second probe tips are each communicatively coupled to respective first and second probe connectors through respective first and second conducting traces disposed upon the printed circuit board. The probe connectors are configured to couple the testing probe to at least one of a high-frequency vector network analyzer and a high-frequency time domain reflectometer. The probe tips translate along their respective central longitudinal axes through respective adjustable couplings to modify respective distances the probe tips extend outward from the printed circuit board.