PCB Thermal Channels for Heat Dissipation
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Solution Overview
Problem
The miniaturization of printed circuit boards poses challenges in efficiently dissipating heat from components like power transistors and LEDs, leading to potential overheating and damage, as traditional heat spreaders occupy valuable space and are not dimensioned for specific heat loads.
Innovation Solution
Incorporating channels filled with thermally conductive materials that penetrate the contact surface and insulating layer of the printed circuit board, allowing for targeted heat management by distributing and radiating heat horizontally and vertically, without interfering with conductor tracks or compromising mechanical stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat-spreading surfaces (copper layers or metal plates) are provided in the immediate vicinity of electronic components, then heat dissipation is improved, but the space available for arranging conductive traces is reduced
Solution Approach 1:
The heat-spreading function is segmented from the traditional continuous copper layer and concentrated into discrete channels filled with thermally conductive material. These channels are strategically positioned only where heat dissipation is needed (at component locations), rather than providing continuous heat spreading across the entire PCB area. This segmentation allows heat-spreading functionality to coexist with conductive trace routing in the same space.
Solution Approach 2:
Instead of providing uniform heat-spreading surfaces across the entire PCB, the invention applies thermal management only locally where needed - specifically at the locations of heat-generating electronic components. The channels are created only in the immediate vicinity of components that require thermal management, leaving other areas of the PCB available for conductive traces and other circuit elements.
2Area of stationary object
If the PCB is miniaturized to provide large number of functionalities in small devices, then space utilization is improved, but heat dissipation capability is reduced
Solution Approach 1:
The invention transitions from two-dimensional heat spreading (using planar copper layers on the PCB surface) to three-dimensional heat management by creating vertical channels that penetrate through the PCB layers. These channels provide additional thermal conduction paths in the vertical dimension, enabling effective heat dissipation from compact components without requiring larger PCB areas.
Solution Approach 2:
Heat dissipation is segmented into discrete vertical channels positioned at specific component locations, allowing targeted thermal management in miniaturized PCB designs. This approach provides efficient heat removal from individual heat-generating components without requiring extensive copper areas, thus maintaining compact PCB dimensions while improving heat dissipation capability.
3Temperature
If channels penetrate the contact surface and insulating layer and are filled with thermally conductive material, then heat dissipation is improved, but the continuous structure of the insulating layer is disturbed
Solution Approach 1:
The channels are filled with thermally conductive materials that serve as intermediaries between the heat-generating components and the PCB structure. These filler materials provide the necessary thermal conduction paths while the channel walls (lined with metal layers) and surrounding insulating material maintain the structural integrity of the PCB. The intermediary thermal material enables heat dissipation without requiring the insulating layer itself to bear the thermal management function, thus preserving its mechanical stability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively dissipates heat from components by utilizing channels filled with materials like copper, silver, or solder, ensuring efficient heat distribution and radiation, reducing the risk of overheating and enhancing the operational reliability of the printed circuit board.
Implementation Method 1
the at least one channel penetrates the contact surface and the insulating layer of the printed circuit board and is filled with a thermally conductive material... the heat from the component can not only be conducted horizontally away from the component, i.e., in the plane of the printed circuit board, but it is also simultaneously conducted to the other side of the insulating layer
Data Source
Figure 1(a)~1(b)
Figure 2
Figure 3
AI summary
For a printed circuit board (1) comprising an insulating layer (2) and a conducting layer (3) arranged on the insulating layer (2) and structured to form a contact surface (4) for an electronic component (11) to be fitted on the printed circuit board (1), in the region of the contact surface (4) the printed circuit board (1) comprises at least one channel (8) passing through the contact surface (4) and insulating layer (2), which is filled with heat conducting material. The method is characterised by the following steps: providing an insulating layer (2) and a conductive layer (3) connected to the insulating layer (2); producing at least one channel (8) passing through the conductive layer (2) and the insulating layer (3); coating the channel (8) with heat-conducting material; structuring the conductive layer (3) to form a contact surface (4) for an electronic component (11) to be equipped; providing a solder deposit (9) at least minimally overlapping the contact surface (4); attaching the electronic component (11); and melting the solder and cooling.