Device for heating and cooling by a printed circuit for regenerating electronic components subjected to radiation
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Solution Overview
Problem
Existing solutions for thermal annealing of CMOS components on printed circuit boards face challenges in efficiently reaching high temperatures, especially for components with inaccessible or small package sizes, leading to inefficient energy dissipation and potential degradation of non-targeted components.
Innovation Solution
A device utilizing heating resistors or thermoelectric elements mounted on the printed circuit board surface, linked to an internal heat transfer surface under the component, with metallic elements such as vias or leads, to concentrate heat and achieve high temperatures necessary for thermal annealing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If a top heating layer is used to heat all components on the printed circuit board, then the heating covers all components uniformly, but the thermal energy dissipates throughout the entire board making it difficult to reach high temperatures for thermal annealing of specific components
Solution Approach 1:
The heating system is segmented into localized heating resistors positioned specifically under each component requiring thermal annealing, rather than a single top layer heating all components. This segmentation concentrates thermal energy where needed while preventing dissipation across the entire board.
Solution Approach 2:
The patent applies local quality by placing heating resistors at specific locations corresponding to individual components that need regeneration. Each heating zone is tailored to the specific component's requirements, providing localized high temperature heating rather than uniform heating across the entire circuit board.
2Loss of energy
If the heating layer is positioned inside the printed circuit board, then energy dissipation is reduced, but the thermal conductivity between the internal layer and surface components becomes insufficient
Solution Approach 1:
The patent introduces an intermediary heat transfer mechanism by using the printed circuit board's ground plane as a thermal conductor. The ground plane acts as an intermediary layer that efficiently transfers heat from the heating resistors to the component packages through thermal conduction, bridging the gap between the internal heating layer and surface components.
3Temperature
If a heating component is positioned on top of the electronic component to be heated, then localized heating is achieved, but this solution is not suitable for components with inaccessible tops or smaller package sizes
Solution Approach 1:
The patent inverts the conventional approach by positioning heating resistors underneath the component rather than on top. The heating elements are placed on the opposite side of the component package, heating the component from below through the PCB substrate, making the solution adaptable to all package types regardless of top accessibility.
4Reliability
If the printed circuit board is heated to high temperatures for thermal annealing, then the target component can be regenerated, but non-targeted components may be degraded by excessive heat
Solution Approach 1:
The heating system is divided into separate, independently controllable heating zones for each component. This segmentation allows precise temperature control at each location, enabling thermal annealing of specific irradiated components while maintaining safe temperatures for other components on the same circuit board.
Solution Approach 2:
Each heating zone is optimized for the specific component it serves, with heating resistors positioned and controlled locally. This local quality approach ensures that high temperatures are applied only where needed for regeneration, while other areas remain at normal operating temperatures, preventing thermal degradation of non-targeted components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for efficient thermal conditioning of electronic components, enabling effective regeneration and rapid cooling, regardless of component size or package type, while minimizing thermal loss and avoiding degradation of non-targeted components.
Implementation Method 1
A device utilizing heating resistors or thermoelectric elements mounted on the printed circuit board surface, linked to an internal heat transfer surface under the component
Implementation Method 2
linked to a heat transfer surface internal to the printed circuit board, arranged under the component, to which said heat transfer surface is linked by one or more metallic elements
Implementation Method 3
The cooling of the components which have been heated in order to be regenerated can make it possible to restore a normal situation more rapidly
Data Source
AI summary
A thermal conditioning device for an electronic component mounted in a package positioned on a multilayer printed circuit board comprises: at least one active component arranged on the printed circuit board, and suitable for producing or absorbing thermal energy, at least one heat transfer surface internal to the printed circuit board, located under the package, a device for transferring the thermal energy between the active component or components and the heat transfer surface, at least one metallic element linking the heat transfer surface to the package situated on the multilayer printed circuit board. A printed circuit board comprising such a thermal conditioning device for an electronic component, and associated heating and cooling methods are also provided.