Multi-Layer PCB Thermal Management for Electronic Components
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Solution Overview
Problem
Electronic components in industrial computers often exceed their critical operating temperatures in both high and low-temperature environments, leading to potential malfunctions and crashes, as existing heat dissipation designs are inadequate for varying power consumption levels.
Innovation Solution
A multi-layer circuit board structure with electronic components in contact with its outer surface, featuring heating circuits and thermal conduction elements on adjacent layers, along with a temperature sensing and control circuit to dynamically regulate temperature through heating or cooling based on preset values.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If usual heat dissipating design is used, then low-power electronic components can operate in high-temperature environments, but high-power electronic components exceed their critical operating temperature
Solution Approach 1:
The patent segments the temperature control function by providing different thermal management solutions for different power consumption levels. Low-power components rely on passive heat dissipation through the PCB, while high-power components are equipped with active heating circuits and thermal conduction elements. This segmentation allows each component type to receive appropriate thermal management without unnecessary complexity.
Solution Approach 2:
The patent applies local quality by providing heating circuits and thermal conduction elements specifically at locations corresponding to high-power electronic components, while low-power components use the general PCB heat dissipation structure. The temperature sensing and control circuits are also locally positioned to monitor and regulate specific component areas, ensuring each region receives appropriate thermal management.
2Reliability
If high-power electronic components generate sufficient heat in low-temperature environments, then they meet operating temperature requirements, but low-power electronic components exceed their critical operating temperature
Solution Approach 1:
The patent implements dynamic temperature control through sensing circuits that continuously monitor component temperatures and control circuits that adjust heating circuit operation accordingly. When low-power components are detected to be below their minimum operating temperature, the control circuit activates the heating circuit to provide supplemental heat. This dynamic adjustment ensures both high-power and low-power components maintain appropriate temperatures regardless of environmental conditions or neighboring component heat generation.
Solution Approach 2:
The patent employs feedback mechanisms where temperature sensing circuits monitor the actual temperature of electronic components and provide this information to control circuits. The control circuits then adjust the heating circuit operation based on this feedback to maintain temperatures within the specified operating range. This closed-loop feedback system ensures precise temperature control for both high-power and low-power components in varying environmental conditions.
3Temperature
If electronic components are placed in multi-layer PCB structure, then heat dissipation is improved for high-power components, but temperature control precision for low-power components deteriorates
Solution Approach 1:
The patent segments the temperature sensing and control function by providing dedicated sensing circuits and control circuits for different power consumption levels. Each electronic component or group of components has its own temperature monitoring and control system, allowing precise temperature management for low-power components while maintaining effective heat dissipation for high-power components through the multi-layer PCB structure.
Solution Approach 2:
The patent applies local quality by positioning temperature sensing circuits and control circuits in close proximity to the electronic components they monitor. This local placement ensures accurate temperature measurement for each component type and enables precise localized control. The heating circuits and thermal conduction elements are also locally positioned to provide targeted thermal management where needed, maintaining measurement precision even within the complex multi-layer PCB structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution maintains electronic components within their operating temperature ranges, enhancing stability and lifespan by preventing overheating or underheating, regardless of environmental conditions.
Implementation Method 1
the heating circuit corresponding to the contact position of the electronic component is enabled. Through the conduction of the thermal conduction element, the electronic component is then heated
Implementation Method 2
Through the conduction of the thermal conduction element, the electronic component is then heated
Implementation Method 3
When the operating temperature of the electronic component detected by the sensing circuit sensing is higher than a second preset value for the electronic component, the control circuit disables the heating circuit corresponding to the contact position of the electronic component. Through the condition of the thermal conduction element, the electronic component is then cooled
Data Source
AI summary
A heating and heat dissipating multi-layer circuit board structure for keeping operating temperatures of electronic components is provided. The outer layer of the multi-layer printed circuit board is in contact with electronic components. The operating temperatures of electronic components are measured through by a temperature measuring circuit. When the operating temperature of at least one electronic component is lower than a default temperature, the heating circuits corresponding to the electronic components are enabled respectively to heat the electronic components through corresponding heat conduction elements. When the operating temperature of at least one electronic component is higher than another default temperature, the heating circuits corresponding to the electronic components are disabled to transfer the heat from the electronic components to the heat conduction elements automatically. Therefore, the structure achieves the goal of keeping the operating temperature of each electronic component in the corresponding environment.