PCB-Mediated Thermal Control for Optical Transceiver Modules
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Solution Overview
Problem
Conventional optical transceiver modules face manufacturing complexity and poor temperature control efficiency due to the small temperature control area of the temperature controller, which is often located next to the optical transceiver, leading to ineffective heat dissipation and control.
Innovation Solution
A temperature control device for optical transceiver modules that includes a processor, a printed circuit board assembly, an optical transceiver module, and a temperature adjustment element, where the processor measures ambient and optical transceiver module temperatures to generate a signal for the temperature adjustment element to perform heat exchange with the printed circuit board assembly, ensuring the optical transceiver operates within a specified temperature range.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the temperature controller is placed next to the header of the optical transceiver, then the device structure is compact, but the temperature control area becomes too small to effectively control the temperature
Solution Approach 1:
The patent moves the temperature controller from a lateral placement (next to the header) to a vertical placement (below the optical transceiver module), utilizing the Z-dimension. This dimensional change allows the controller to have a larger temperature control area that directly covers the optical transceiver module, resolving the contradiction between compact structure and adequate control area.
2Temperature
If the temperature controller is placed below the optical transceiver module, then the temperature control area is increased, but the manufacturing process complexity increases
Solution Approach 1:
The patent integrates the temperature controller and optical transceiver module into a unified structure where the controller is disposed directly below the module on the same printed circuit board. This merging of functions and structures simplifies the manufacturing process by reducing the number of separate components and assembly steps, while maintaining the advantage of a larger temperature control area.
3Device complexity
If the temperature controller is located next to the header, then the device layout is simple, but the temperature control efficiency is poor
Solution Approach 1:
The patent introduces the printed circuit board as an intermediary thermal conduction path. The temperature controller disposed below the optical transceiver module uses the PCB as a thermal medium to efficiently transfer heat to or from the module, significantly improving temperature control efficiency while maintaining layout simplicity through the standardized PCB structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances temperature control efficiency by allowing directional heat transfer, increasing the thermal contact area, and maintaining the optical transceiver module within a defined operating temperature range, improving manufacturing yield and control precision.
Implementation Method 1
The temperature adjustment element is configured to perform heat exchange with the printed circuit board assembly according to the temperature adjustment signal to adjust a temperature of the optical transceiver module into the operating temperature range
Data Source
AI summary
An optical transceiver module temperature control device includes a processor, a printed circuit board assembly, an optical transceiver module and a temperature adjustment element. The processor is configured to measure an ambient temperature. The printed circuit board assembly includes a first side and a second side. The first side is opposite to the second side. The optical transceiver module is disposed on the first side of the printed circuit board assembly. The temperature adjustment element is coupled to the processor and disposed on the second side of the printed circuit board assembly. The processor is configured to generate a temperature adjustment signal according to the ambient temperature and an operating temperature range. The temperature adjustment element is configured to perform heat exchange with the printed circuit board assembly according to the temperature adjustment signal to adjust a temperature of the optical transceiver module into the operating temperature range.