Printed Circuit Board Through-Holes for Heat Transfer and Voltage Insulation
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Solution Overview
Problem
Existing printed circuit boards face challenges in efficiently conducting heat from electrical components to heat sinks while maintaining voltage insulation, often requiring thick adhesive films for both mechanical attachment and insulation, which are costly and may hinder heat conduction.
Innovation Solution
A printed circuit board design featuring a thin main insulation layer with upper and lower plated through-holes made of good thermal conductors, such as copper, to facilitate heat transfer directly between the components and the heat sink, while a separate adhesive film is used solely for mechanical attachment, ensuring electrical insulation is maintained by the main insulation layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a thick adhesive film is used for both mechanical attachment and voltage insulation, then voltage insulation between electrical components and heat sink is ensured, but heat conduction is hindered and cost increases
Solution Approach 1:
The patent divides the adhesive film into two separate functional layers: a thin adhesive layer for mechanical attachment and a main insulation layer for voltage insulation. This segmentation allows each layer to be optimized independently - the adhesive layer can be thin for good thermal contact, while the insulation layer provides sufficient electrical isolation without impeding heat flow from the heat sink to the PCB.
Solution Approach 2:
The patent extracts the voltage insulation function from the adhesive film and assigns it to a dedicated main insulation layer. This extraction removes the conflicting requirement from the adhesive layer, allowing it to focus solely on mechanical attachment with minimal thickness, thereby improving heat conduction while the separate insulation layer maintains electrical safety.
2Reliability
If a thick adhesive film is used for both mechanical attachment and voltage insulation, then voltage insulation is ensured, but cost increases
Solution Approach 1:
By segmenting the adhesive structure into separate functional layers, the patent enables cost optimization - the adhesive layer can use standard low-cost materials and thin dimensions, while the insulation layer can use cost-effective insulating materials. This avoids the need for expensive thick adhesive films that combine both functions, reducing overall material and manufacturing costs.
3Temperature
If plated through-holes are added for heat conduction, then heat transfer efficiency improves, but manufacturing complexity increases
Solution Approach 1:
The patent merges the heat conduction function with the existing plated through-holes that are already part of the PCB manufacturing process. By utilizing these pre-existing structural features for thermal management, the patent improves heat transfer without adding significant manufacturing complexity, as the plated through-holes are created during standard PCB fabrication.
Solution Approach 2:
The plated through-holes serve multiple functions: electrical connectivity between PCB layers and thermal conduction from the heat sink to the PCB. This multi-functionality eliminates the need for separate heat conduction structures, maintaining manufacturing simplicity while achieving effective heat management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves effective thermal contact resistance with guaranteed voltage insulation, allowing for efficient heat conduction and cost-effective production of circuit arrangements.
Implementation Method 1
Heat conduction from the electrical components on the top side to the heat sink on the bottom side is largely taken over by the upper plated through-holes and lower plated through-holes. The plated through-holes are produced from a material having good heat conduction, e.g., a metal material.
Implementation Method 2
A main insulation layer is arranged between the top side and the bottom side, and the main insulation layer completely electrically insulates electrically conductive layers arranged between the main insulation layer and the top side from electrically conductive layers arranged between the main insulation layer and the bottom side.
Implementation Method 3
heat sinks are metal, e.g., are made of aluminum, and are attached to a bottom side of a printed circuit board by a double-sided adhesive film, for example
Data Source
AI summary
A printed circuit board (PCB) includes a top side for receiving electrical components, a bottom side for receiving a heat sink, electrically conductive layers, and electrically insulating insulation layers. A main insulation layer is arranged between the top and bottom sides. The main insulation layer completely electrically insulates electrically conductive layers arranged between the main insulation layer and the top side from electrically conductive layers arranged between the main insulation layer and the bottom side. Upper plated through-holes extend from an outer insulation layer adjacent the top side into an inner insulation layer adjacent the main insulation layer. Lower plated through-holes extend from the bottom side into a lower insulation layer adjacent the main insulation layer. A circuit arrangement includes the printed circuit board, electrical components fitted to the top side and connected to the PCB, and heat sink(s) fitted to the bottom side and connected to the PCB.