PCB Thermal Via Interconnect for Compact Die Heat Removal
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Solution Overview
Problem
Modern electronics require tighter integration, leading to stronger demands for tolerances and compactness, particularly in connections that effectively manage heat transfer away from active integrated circuitry surfaces.
Innovation Solution
The use of a printed circuit board (PCB) with thermal vias filled with thermally conductive material, and a package comprising a substrate and a die with an active side and a heat-removal side, where the heat-removal side is connected to the thermal vias via solder balls, facilitating heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If tighter integration is implemented to increase electronic device power, then device functionality and power are improved, but heat removal capability deteriorates due to increased heat generation in compact spaces
Solution Approach 1:
The patent transitions heat removal from a two-dimensional surface cooling problem to a three-dimensional volumetric solution by implementing vertical thermal vias that extend through multiple PCB layers. This dimensional change allows heat to be conducted away from the die in the vertical direction, effectively increasing the heat dissipation volume without expanding the horizontal footprint, thus resolving the contradiction between tight integration and heat removal capability
Solution Approach 2:
The patent introduces thermal vias filled with thermally conductive material as an intermediary heat transfer path between the die and the PCB. This intermediary structure provides a dedicated thermal conduction channel that bridges the heat source (die) and the heat sink (PCB), enabling efficient heat removal independent of the electrical connection structure, thereby resolving the heat removal limitation in tightly integrated designs
2Volume of moving object
If compact arrangement of electronic components is implemented, then device size is reduced, but heat transfer efficiency deteriorates due to reduced space for thermal management
Solution Approach 1:
The patent utilizes the vertical dimension by implementing thermal vias that extend through multiple PCB layers, transforming the heat transfer path from a planar arrangement to a three-dimensional structure. This allows compact horizontal component placement while maintaining effective heat transfer through the vertical via path, thus reducing device footprint without sacrificing heat transfer efficiency
Solution Approach 2:
The patent embeds thermal vias within the PCB structure itself, nesting the heat transfer function within the existing board architecture. The thermal vias are integrated into the PCB layers, allowing heat conduction functionality to be embedded within the structural framework rather than requiring separate external thermal management components, thereby achieving compact design with efficient heat transfer
3Temperature
If thermal vias are used to improve heat removal, then heat transfer capability is improved, but manufacturing complexity increases due to via filling and alignment requirements
Solution Approach 1:
The patent implements thermal vias that serve dual purposes: electrical connection and thermal conduction. The same via structure that provides electrical interconnection between layers also functions as a heat transfer path when filled with thermally conductive material. This multi-functionality eliminates the need for separate dedicated thermal pathways, reducing manufacturing complexity while maintaining heat transfer capability
Solution Approach 2:
The patent merges the thermal conduction function with the existing electrical via structure. By filling standard electrical vias with thermally conductive material, the design combines electrical connectivity and thermal management into a single integrated feature, thereby improving heat transfer capability without adding separate manufacturing processes or structures
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables a compact arrangement of electronic components with effective heat removal properties, particularly beneficial for multi-element arrangements like antenna arrays, by allowing heat to be transferred from the active side of the die through the solder balls and thermal vias.
Implementation Method 1
one or more thermal vias filled with thermally conductive material... the heat-removal side of the die is in thermally conductive connection with the one or more thermal vias via solder balls... heat is transferable from the active side and/or material of the die via the solder balls, through the thermal vias
Data Source
AI summary
There is disclosed an electronic device comprising a printed circuit board, PCB, the PCB having one or more thermal vias filled with thermally conductive material. The electronic device further having a package, the package including a substrate and a die, the die having an active side with integrated circuity, and a heat-removal side. The heat-removal side of the die is in thermally conductive connection with the one or more thermal vias via solder balls. The disclosure also pertains to related devices and methods.