PCB Thermal Vias for Automotive Ventilation Heat Dissipation
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Solution Overview
Problem
Conventional ventilation devices for motor vehicles are hindered by the size, weight, and cost of radiators used for heat dissipation in electronic components, which occupy valuable space and increase the overall weight and expense.
Innovation Solution
The ventilation device eliminates the need for a radiator by using air flow generated by a propeller to dissipate heat through metallized holes in the printed circuit board, which act as thermal vias, and optionally includes a heat sink secured to the board to enhance cooling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a radiator is added to the printed circuit board to dissipate heat from electronic components, then the heat dissipation capability is improved, but the device size, weight, and cost increase significantly
Solution Approach 1:
The patent merges the heat dissipation function with the existing printed circuit board by drilling through-holes directly in the PCB and filling them with heat-conducting material. This integration eliminates the need for a separate radiator component, thereby reducing weight while maintaining effective heat dissipation from the electronic components.
Solution Approach 2:
The printed circuit board is given multiple functions: it serves as both the electrical connection substrate and the heat dissipation structure. The through-holes in the PCB serve dual purposes of electrical connectivity and thermal management, allowing the board to perform both circuit functions and radiator functions simultaneously.
2Temperature
If a radiator is added to the printed circuit board to dissipate heat from electronic components, then the heat dissipation capability is improved, but the device occupies more space in the ventilation system
Solution Approach 1:
The heat dissipation function is merged into the printed circuit board structure itself through the addition of through-holes filled with heat-conducting material. This eliminates the need for a separate radiator component that would occupy additional space, as the heat dissipation occurs within the existing PCB footprint.
Solution Approach 2:
The heat dissipation approach transitions from a two-dimensional surface-mounted radiator to a three-dimensional structure by drilling through-holes through the PCB thickness. This vertical dimension allows heat to be conducted from the component side through the board to the opposite side, dissipating heat without increasing the horizontal footprint of the device.
3Temperature
If a radiator is added to the printed circuit board to dissipate heat from electronic components, then the heat dissipation capability is improved, but the manufacturing cost increases
Solution Approach 1:
The heat dissipation function is combined with the printed circuit board manufacturing process itself. The through-holes are created and filled with heat-conducting material during standard PCB fabrication, eliminating the need for separate radiator components and their associated assembly costs, thereby reducing overall manufacturing complexity and expense.
4Device complexity
If the printed circuit board is cooled directly by airflow through holes in the board, then the device complexity is reduced by eliminating the radiator, but the heat dissipation efficiency must be maintained without the radiator
Solution Approach 1:
A heat-conducting material is introduced as an intermediary substance filled in the through-holes of the PCB. This material acts as a thermal bridge, efficiently conducting heat from the electronic components on one side of the board to the airflow-exposed surface on the other side, thereby maintaining heat dissipation efficiency while enabling direct airflow cooling.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design results in a lighter, more compact, and cost-effective ventilation device that effectively cools electronic components without the need for a separate radiator, ensuring reliable thermal management compatible with automotive applications.
Implementation Method 1
an airflow circulated by the fan is directed onto one face of the circuit board... so as to be cooled by the airflow
Implementation Method 2
at least one hole, such as a hole which is, for example, metallized around its periphery... A heat-conducting medium extends into the hole. This heat-conducting medium forms a thermal drain between the heat present on the first face and generated by the electronic component
Data Source
Figure 1~3
Figure 4~6
AI summary
The invention relates to a ventilation device (1) for a ventilation unit of a motor vehicle passenger compartment, comprising: an impeller (4) that generates an air flow (11, 12) and can be driven by an electric motor; and a printed circuit board (15) having secured thereto at least one electronic component (19) that can release calories. The printed circuit board (15) comprises at least one through-hole (18) provided in a part (21) of the printed circuit board (15). The ventilation device (1) is configured such that the air flow (11, 12) generated by the impeller (4) moves along said part (21) of the printed circuit board (15).