PCB Structure with Third Pad to Secure Conductive Wire
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Solution Overview
Problem
In complex integrated circuit (IC) devices, long conductive wires in three-dimensional IC packages lead to conductive wire crossing problems and wire-to-wire shorts, reducing the performance of printed circuit boards (PCBs) due to floating wires above semiconductor chips.
Innovation Solution
A printed circuit board structure with a semiconductor chip, first and second pads, and a conductive wire, where a third pad or adhesive tape is used to secure a portion of the conductive wire on the semiconductor chip, preventing it from floating and addressing the crossing and short issues.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If long conductive wires are used in 3DIC packages to connect pads, then electrical connection between distant pads is achieved, but conductive wire crossing problems and wire-to-wire shorts occur reducing PCB performance
Solution Approach 1:
The patent introduces a third pad as an intermediary element positioned between the first and second pads. The conductive wire is configured to contact this third pad, which acts as a mediator to support the wire and prevent it from floating above the semiconductor chip. This intermediary structure eliminates wire crossing problems and prevents wire-to-wire shorts while maintaining the electrical connection function.
2Ease of operation
If conductive wire is positioned above semiconductor chip to connect pads, then electrical connection is established, but wire floating causes crossing problems and reduces signal performance
Solution Approach 1:
The third pad serves as a mediator that provides a designated contact point for the conductive wire on the semiconductor chip surface. Instead of the wire floating above the chip, it is supported by the third pad, which simplifies the wire routing and eliminates crossing problems while maintaining the electrical connection between the first and second pads.
3Reliability
If third pad is added to support conductive wire, then wire crossing and short problems are solved, but device structure complexity increases
Solution Approach 1:
The third pad is designed to serve multiple functions: it provides mechanical support for the conductive wire, prevents wire-to-wire shorts, eliminates wire crossing problems, and maintains electrical connection stability. By making the third pad multi-functional, the patent reduces the need for additional separate structures, thereby limiting the increase in device complexity while achieving multiple benefits.
Data Source
AI summary
The disclosure provides a printed circuit board structure. The printed circuit board structure includes a printed circuit board, a semiconductor chip, a first pad, a second pad, a conductive wire, and a third pad. The semiconductor chip is disposed on the printed circuit board. The first pad is disposed on the semiconductor chip. The second pad is disposed on the printed circuit board. The conductive wire electrically connects the first pad and the second pad. The third pad is disposed between the first pad and the second pad. The conductive wire has a portion located on the third pad.