PCB Through-Hole Geometry for Self-Aligned Semiconductor Assembly

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Solution Overview

Problem

Existing semiconductor device manufacturing methods face challenges in maintaining the positional relationship between insulating substrates and printed circuit boards during heat-treatment, leading to potential defects due to warpage and loss of contact between conductive members.

Innovation Solution

The use of a lower jig with specific columnar members and through parts allows for precise positioning and expansion of the printed circuit board relative to the insulating substrates, ensuring a self-alignment effect and reducing the risk of defects during heat-treatment.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If conventional manufacturing methods are used without specific positioning structures, then the manufacturing process is simpler, but the positional relationship between insulating substrates and printed circuit boards deteriorates during heat-treatment due to warpage

Engineering Contradiction:

Improvepositional relationshipVSAvoidstructure

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

A lower jig is introduced as an intermediary device during heat-treatment to maintain the positional relationship between the insulating substrate and printed circuit board. The lower jig includes columnar members that fit into through parts of the printed circuit board, acting as a mediator to prevent warpage-induced misalignment while allowing controlled expansion.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The through parts of the printed circuit board are designed with specific geometric parameters (cross-sectional shapes) that match corresponding columnar members. This parameter matching enables precise positioning while accommodating thermal expansion during heat-treatment, resolving the contradiction between positioning precision and structural complexity.

Inventive Principle:

Principle #35Parameter changes

2Manufacturing precision

If rigid positioning structures are used to maintain positional relationship, then positioning precision is improved, but the ability to accommodate thermal expansion deteriorates

Engineering Contradiction:

Improvepositional relationshipVSAvoidexpansion accommodation

Core Design Contradiction:

Manufacturing precisionVSAdaptability or versatility

Solution Approach 1:

The positioning system transitions from a static rigid structure to a dynamic system that adapts during heat-treatment. The columnar members and through parts allow controlled movement and expansion accommodation while maintaining positional relationship, enabling the system to adapt to thermal changes without losing positioning precision.

Inventive Principle:

Principle #15Dynamics

Solution Approach 2:

The columnar members are nested within the through parts of the printed circuit board, creating a hierarchical positioning structure. This nesting allows the inner columnar members to move slightly relative to the outer through parts, accommodating thermal expansion while maintaining overall positional stability.

Inventive Principle:

Principle #7Nested doll (Nesting)

3Manufacturing precision

If an upper jig is used to maintain positional relationship during heat-treatment, then positioning precision is improved, but handling complexity and defect risk increase

Engineering Contradiction:

Improvepositional relationshipVSAvoidhandling

Core Design Contradiction:

Manufacturing precisionVSEase of operation

Solution Approach 1:

The upper jig is extracted from the system, leaving only the lower jig for positioning during heat-treatment. This simplification reduces handling complexity and the risk of defects while maintaining positioning precision through the carefully designed columnar members and through parts configuration.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The lower jig with its columnar members and through parts creates a self-aligning system during heat-treatment. The geometric matching between columnar members and through parts enables automatic positioning without requiring an upper jig, allowing the system to self-correct and maintain positional relationship during thermal expansion.

Inventive Principle:

Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables the semiconductor assembly to maintain a stable positional relationship without the need for an upper jig, facilitating easier handling and reducing the likelihood of defective products due to warpage or loss of contact.

Implementation Method 1

a lateral direction of the printed circuit board is an expansion direction of the printed circuit board when heat-treating the semiconductor assembly 50

Methodology Applied

Scientific EffectThermal expansion: Thermal Expansion

Data Source

PatentUS12230600B2Semiconductor device having through parts of different shapes

Publication Date: 2025.02.18 FUJI ELECTRIC CO LTD

AI summary

A semiconductor device including: a semiconductor chip; a plurality of insulating substrates mounted with the semiconductor chip; a printed circuit board facing the plurality of insulating substrates; and a conductive member for electrically connecting the plurality of insulating substrates and the printed circuit board is provided. The printed circuit board has a first through part arranged between the plurality of insulating substrates being adjacent to each other in a top view, and a second through part different from the first through part in shape in the top view.