PCB Through Hole Liquid Cooling for Dense Electronics
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional air-cooling methods struggle to effectively manage heat dissipation in densely packed electronic systems, particularly for smaller components involved in power distribution, leading to thermal stress and reduced efficiency.
Innovation Solution
A liquid cooling system utilizing PCB through holes for coolant circulation, incorporating manifold components and cooling channels to distribute and collect coolant, with dual-purpose electrical and coolant connections, and a control system for temperature-responsive coolant distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If conventional air-cooling approaches are used, then the system structure is simple, but heat dissipation effectiveness deteriorates in densely packed electronic systems
Solution Approach 1:
The patent transitions from air-cooling to liquid-cooling by introducing coolant flow through PCB through-holes. The liquid coolant directly contacts the PCB and electronic components, enabling efficient heat removal through forced convection, thereby resolving the insufficient heat dissipation effectiveness in densely packed systems.
Solution Approach 2:
The patent utilizes the PCB itself as a porous structure with through-holes that allow coolant penetration. The coolant flows through the PCB substrate, making direct thermal contact with mounted components, thus achieving effective cooling without requiring complex external heat sinks or airflow management.
2Temperature
If liquid cooling solutions are implemented for high-powered components, then heat dissipation improves, but smaller power distribution components are overlooked leading to uneven cooling
Solution Approach 1:
The patent makes the PCB serve multiple functions: as the structural substrate for mounting components, as the electrical interconnection circuit board, and as the coolant distribution manifold. The through-holes provide universal cooling to all components regardless of power consumption level, ensuring uniform cooling across the entire system.
Solution Approach 2:
The PCB structure itself is utilized for coolant distribution without requiring separate cooling manifolds or additional components. The existing PCB geometry and through-holes are repurposed to create an integrated cooling system that automatically provides uniform cooling to all mounted components.
3Temperature
If liquid cooling systems are added to PCBs, then heat dissipation effectiveness improves, but manufacturing complexity increases
Solution Approach 1:
The patent merges the cooling system integration into the standard PCB manufacturing process. Coolant channels and through-holes are created using conventional PCB fabrication techniques such as drilling, plating, and routing, eliminating the need for post-manufacturing assembly of separate cooling components.
Solution Approach 2:
The coolant flow paths and cooling structures are prepared during the initial PCB manufacturing stage rather than being added later. Through-holes are drilled and plated, and coolant channels are routed during board fabrication, enabling seamless integration of cooling functionality without additional manufacturing steps.
4Temperature
If through-holes are used for coolant circulation, then cooling efficiency improves, but electrical leakage risks increase
Solution Approach 1:
The patent introduces electrically insulating materials or coatings within the coolant through-holes to prevent electrical conduction between the coolant and PCB traces. This intermediary layer maintains electrical isolation while allowing thermal and fluid communication, thereby eliminating leakage risks.
Solution Approach 2:
The patent uses electrically insulating materials to create an electrically inert environment within the coolant channels. By lining through-holes with non-conductive materials or using non-conductive sealants, the system prevents any potential electrical conduction through the liquid coolant path.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances heat dissipation, extends component lifespan, and improves system performance by minimizing current leakage and reducing power consumption, offering superior cooling compared to conventional air-cooling systems.
Implementation Method 1
The coolant absorbs heat from electronic components through thermal conduction, transferring thermal energy from the components to the liquid coolant
Implementation Method 2
The cooling system utilizes convection to distribute thermal energy and maintain thermal equilibrium across the electronic components
Data Source
AI summary
Described herein are devices, systems, methods, and processes for an efficient liquid cooling system for electronic components mounted on a printed circuit board (PCB). The system utilizes PCB through holes to carry a liquid coolant. The cooling system includes a coolant loop through which a pump circulates the coolant. A cooling sub-assembly includes a cooling channel thermally coupled to the component to be cooled. The cooling sub-assembly further includes a coolant supply PCB through hole that carries the cooled coolant from a supply manifold on the bottom side of the PCB to the cooling channel on the top side of the PCB and a coolant return PCB through hole that carries the heated coolant from the cooling channel to the return manifold on the bottom side of the PCB. The cooling system includes a control system for coolant distribution that can react to component temperatures.