PCB Through Hole Insulation for ESD Protection
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Solution Overview
Problem
Electrostatic discharge on printed circuit boards can lead to excessive voltage accumulation in conductive holes, potentially damaging electronic elements due to the direct conduction of static charges, which existing technologies fail to adequately mitigate.
Innovation Solution
Incorporating a through hole between electronic elements and conductive holes on the printed circuit board, which separates the electronic elements from the conductive holes, and using a conductive structure like a screw or conductive ring to ground the circuit board, thereby reducing direct static charge conduction and preventing element breakdown.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conductive hole is provided on the printed circuit board for electrostatic discharge, then static charges can be conducted to ground, but excessive voltage accumulation in the conductive hole can damage electronic elements
Solution Approach 1:
The conductive hole is divided into multiple segments by insulating layers, creating a segmented conductive path. This segmentation prevents excessive voltage accumulation in a single hole while maintaining electrostatic discharge capability, as the voltage is distributed across multiple segments rather than concentrated in one location.
Solution Approach 2:
Insulating layers are introduced as intermediary structures between the conductive hole and electronic elements. These intermediaries prevent direct contact between high-voltage discharge paths and sensitive electronic components, thereby protecting elements from voltage accumulation damage while allowing electrostatic discharge to occur.
2Area of stationary object
If electronic elements are disposed near conductive holes for compact design, then space utilization is improved, but the risk of electrostatic damage to elements increases
Solution Approach 1:
Insulating layers serve as intermediary barriers between conductive holes and electronic elements, enabling close proximity placement while preventing direct electrostatic damage. This allows compact design with improved space utilization without increasing damage risk, as the intermediaries protect elements even when positioned near discharge paths.
Solution Approach 2:
The conductive hole structure is segmented by insulating layers, creating multiple isolated conductive regions. This segmentation allows electronic elements to be positioned near the overall conductive hole structure while the segmented nature prevents continuous voltage paths from reaching the elements, enabling compact layout without increased risk.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The through hole effectively reduces the risk of electronic element damage by separating them from the conductive holes, preventing breakdown due to excessive electrostatic charge accumulation, while the conductive structure ensures efficient static discharge to ground, enhancing the reliability of the printed circuit board.
Implementation Method 1
Electrostatic discharge of the printed circuit board is one of important factors that affects normal working of the printed circuit board, the electrostatic discharge means that static charges affecting working of the electronic elements on the printed circuit board are weakened or conducted away, for example, conducted to the ground
Implementation Method 2
at least one through hole is disposed between the conductive hole and at least part of the electronic element
Data Source
AI summary
A printed circuit board and an electronic apparatus having the printed circuit board are provided. The printed circuit board includes a circuit board body and an electronic element disposed on the circuit board body, the circuit board body is provided with a conductive hole, the circuit board body is grounded by a conductor provided in the conductive hole, and at least one through hole is disposed between the conductive hole and at least part of the electronic element.