PCB Through-Hole with Open Side Wall for Adjustable Terminal Positioning
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Solution Overview
Problem
In electronic devices, the integration of Printed Circuit Boards (PCBs) with high power components requires efficient cooling and compact packaging, but conventional PCB modules face challenges in adapting to varying dimensions and thermal management due to fixed mounting positions and inadequate spacing, leading to wasted space and reduced cooling efficiency.
Innovation Solution
A PCB module design featuring a through-hole with a partially open side wall allows for adjustable terminal positioning, enabling the PCB to be aligned optimally with the host board and enclosure for improved thermal distribution and denser packing, accommodating larger components and reducing enclosure size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the spacing between PCB modules is increased to accommodate larger power components, then the component dimensions can be larger, but the enclosure size increases and space is wasted
Solution Approach 1:
The patent implements an adjustable mounting structure where the PCB module's position relative to the host board can be dynamically adjusted. The PCB is mounted on a movable support structure that allows changing the distance between the PCB and host board, enabling optimization of space utilization while accommodating different power component sizes without increasing enclosure volume.
Solution Approach 2:
The invention changes the mounting parameters of the PCB module by introducing adjustable spacing mechanisms. The distance between the PCB and host board can be varied to optimize both component accommodation and space efficiency, allowing the same enclosure to host modules with different component dimensions.
2Productivity
If the pitch between PCB modules is reduced to increase component density, then more PCB modules can fit in the enclosure, but thermal management becomes more difficult
Solution Approach 1:
The patent introduces a vertical dimension for thermal management by allowing adjustment of the PCB's vertical position relative to the host board. This creates additional thermal pathways through the enclosure structure, enabling heat dissipation in the vertical direction while maintaining close horizontal spacing between modules for high density.
3Length of stationary object
If the PCB module height is reduced to achieve a low profile, then the enclosure size can be minimized, but the power component dimensions are limited
Solution Approach 1:
The invention implements a nested structure where the PCB is mounted within an adjustable support structure that is itself mounted on the host board. This nested arrangement allows the PCB module to maintain a low external profile while providing internal adjustment space to accommodate larger power components through vertical positioning changes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances thermal management by allowing precise alignment of the PCB with cooling surfaces, increases component density, and reduces enclosure size while maintaining effective thermal resistance, addressing the limitations of conventional PCB modules.
Implementation Method 1
The high power densities needed in the power components of the PCB module further require an efficient cooling of the power components. A thermal loss distribution of the electronic packages is typically managed by a heat spreader, such as a base plate made of a high thermo-conductive material
Data Source
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AI summary
Embodiments herein relate to a Printed Circuit Board, PCB, (1) and a terminal (2) for connecting the PCB (1) to an electrical component. The PCB (1) comprises a through-hole (11) for receiving the terminal (2). The through-hole (11) has a partially open side wall (12), wherein the side wall (12) is open along at least a part of a length (L) of the 5 through-hole (11) perpendicular to a radius (R) of the through-hole (11). This allows the terminal (2) to protrude through the open side wall (12) when received by the through-hole (11), such that a position of the terminal (2) is adjustable along the length of the open side wall (12). The terminal (2) comprises a base (21), adapted to be received by the through-hole (11) of the PCB (1) and to create a press fit with the side wall (12) of the through-hole 10 (11), and a pin (22) projecting from a surface (23) of the base (21). The pin (22) is adapted to protrude through the open side wall (12), when the base (21) is inserted into the through-hole (11) of the PCB (1). Furthermore, embodiments herein relate to a method for assembling a PCB module (120) comprising the terminal (2) and the PCB (1).