Light-Emitting Device Circuit Board Through Hole Alignment
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Solution Overview
Problem
Traditional light-emitting devices in projectors suffer from reduced optical performance due to assembly tolerance issues affecting the relative positioning of aspherical lenses and LED chips, leading to suboptimal light condensation and beam quality.
Innovation Solution
A light-emitting device design featuring a circuit board with through holes of varying diameters, where the light-condensing element is directly mounted on the circuit board, and positioning posts are fixed using glue within larger pathways, ensuring precise alignment and increased joint strength, thereby improving the assembly accuracy and optical performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If aspherical lenses are disposed on a frame of the casing corresponding to LED chips, then the light-emitting device can be assembled, but the relative positioning accuracy deteriorates due to assembly tolerance
Solution Approach 1:
The patent merges the frame structure with the circuit board by directly disposing the light-condensing element (aspherical lens) on the circuit board rather than on a separate frame. This integration eliminates the intermediate frame component and its associated assembly tolerances, directly improving the relative positioning accuracy between the aspherical lens and LED chip while maintaining assembly feasibility through direct mounting structures.
Solution Approach 2:
The patent introduces a positioning post as an intermediary component that extends from the circuit board to the aspherical lens. This positioning post serves as a precise locating mechanism that ensures accurate relative positioning between the LED chip and aspherical lens, overcoming the positioning accuracy issues that would arise from direct assembly without intermediate positioning structures.
2Device complexity
If light source modules are disposed at an opening of the casing, then the assembly structure is simple, but the optical performance deteriorates due to positioning inaccuracies
Solution Approach 1:
The patent merges the light source module assembly with the circuit board by directly disposing the light-condensing element on the circuit board. This integration simplifies the overall assembly structure by eliminating separate frames and mounting structures, while simultaneously improving optical performance through enhanced positioning accuracy between optical components.
Solution Approach 2:
The patent applies different structural solutions to different parts of the assembly: the circuit board provides a rigid base with precise positioning features (through holes and positioning posts), while the aspherical lens receives specialized positioning support. This localized optimization ensures high positioning accuracy at critical interfaces without unnecessarily complicating the overall simple assembly structure.
3Ease of manufacture
If standard-sized pathways are used in the circuit board, then the manufacturing is simple, but the joint strength and positioning accuracy deteriorate
Solution Approach 1:
The patent applies different pathway dimensions at different locations within the circuit board: larger second pathways are used for positioning posts requiring high joint strength and positioning accuracy, while smaller first pathways are used for other purposes. This localized differentiation optimizes both joint strength and positioning accuracy where needed, while maintaining manufacturing simplicity through a systematic pathway design that can be implemented using standard PCB manufacturing processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances the optical performance of light-emitting devices by ensuring accurate positioning of light-condensing and light-emitting elements, reducing assembly tolerance, and increasing the joint strength between components, resulting in improved beam quality and reduced likelihood of glue leakage.
Implementation Method 1
Each of the aspherical lenses is disposed on the corresponding LED chip for appropriately condensing light emitted from the corresponding LED chip
Implementation Method 2
The glue is disposed in the second pathways for fixing each of the positioning posts in the corresponding through hole
Data Source
AI summary
A light-emitting device includes a circuit board, a light-emitting element, a light-condensing element, and a glue. The circuit board has through holes, a first surface, and a second surface. The through hole has a first pathway and a second pathway. The first pathway extends from the first surface into the circuit board. The second pathway extends from the second surface into the circuit board and communicates with the first pathway. An accommodating space of the second pathway is greater than that of the first pathway. The light-emitting element is disposed on and electrically connected to the first surface. The light-condensing element has positioning posts. A portion of the light-condensing element is disposed on the light-emitting element. The positioning post passes through the first pathway and is located inside the second pathway. The glue is disposed in the second pathway for fixing the positioning posts in the through hole.