Circuit Board Through Hole Solder Blocking via Resin Insert
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Solution Overview
Problem
Existing electronic devices face challenges in preventing solder from flowing into through holes in circuit boards, which can lead to connectivity issues and overheating, and existing solutions do not adequately address these problems.
Innovation Solution
A circuit board structure featuring a heat-transfer layer with a resin block inside the through holes to block solder flow, combined with a connection layer made of resin material to manage bubbles and ensure reliable solder connections and heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a through hole is formed in a circuit board with an opening on a pad and only a plated layer is formed on the inner circumference surface, then the structure is simple and easy to manufacture, but solder can flow into the through hole causing connectivity issues and overheating
Solution Approach 1:
The invention extracts the harmful function of the through hole (solder flow path) by filling it with resin material, while maintaining the useful function of electrical connection through the plated layer on the inner circumference surface. This separates the conflicting requirements of through hole openness for simplicity versus closure for solder prevention.
Solution Approach 2:
The invention uses composite material structure combining plated layer (metal) on the inner circumference surface for electrical connection and resin material filling the through hole for solder prevention. This composite approach resolves the contradiction by assigning different materials to different functions within the same structure.
2Reliability
If a circular resist is formed around the opening of the through hole to prevent solder from flowing in, then solder flow is prevented, but manufacturing complexity increases and bubbles may be trapped
Solution Approach 1:
The invention performs preliminary action by forming the plated layer on the inner circumference surface of the through hole before filling it with resin material. This sequence prevents solder flow while avoiding the complexity of forming circular resists around openings, as the plating process itself creates the protective barrier.
Solution Approach 2:
The plated layer on the inner circumference surface acts as an intermediary between the through hole opening and the resin filling, providing a reliable barrier against solder flow while facilitating easier manufacturing compared to forming circular resists. The intermediary structure eliminates the need for complex resist formation processes.
3Reliability
If the through hole is completely filled with resin material, then solder flow is effectively prevented, but bubbles may be trapped inside causing manufacturing defects
Solution Approach 1:
The invention performs preliminary action by forming the plated layer on the inner circumference surface before filling the through hole with resin material. This sequence allows bubbles to escape during the filling process while maintaining effective solder prevention, thereby improving manufacturing precision without compromising reliability.
Solution Approach 2:
The invention utilizes the plated layer on the inner circumference surface as a porous or permeable structure that allows trapped bubbles to escape during resin filling, while still maintaining its function as a barrier against solder flow. This resolves the contradiction between complete filling for solder prevention and bubble elimination for manufacturing precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively prevents solder from entering through holes, ensuring strong connections and efficient heat dissipation while minimizing manufacturing defects and overheating risks.
Implementation Method 1
a heat-transfer layer, and a block. The circuit board is configured to be mounted with an electronic component... The heat-transfer layer is formed on the inner surface of a through hole in the circuit board
Data Source
AI summary
According to one embodiment, a television apparatus includes a circuit board, a pad, a heat-transfer layer, and a block. The circuit board is mounted with an electronic component. The pad is provided on a surface of the circuit board. The heat-transfer layer is formed on the inner surface of a through hole in the circuit board. The through hole has an opening on the pad. The block contains a resin material and is located inside the heat-transfer layer to block the through hole.