Circuit Board Through Holes for Heatsink Thermal Conduction
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Solution Overview
Problem
Conventional electronic equipment cooling structures often restrict component layout due to the size and placement of heat radiating apparatuses, limiting cooling performance and flexibility.
Innovation Solution
A circuit board design with through holes and heat conduction paths connecting electronic components to a heat radiating apparatus on the opposite side, allowing for enhanced cooling performance and increased component layout flexibility by eliminating the need for space on the component's upper side.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat radiating apparatus is disposed on the upper side of a circuit board above an integrated circuit apparatus, then cooling performance is provided, but the heat radiating apparatus constitutes a constraint in laying out other components and increases the size of the cooling structure
Solution Approach 1:
The patent inverts the conventional cooling structure by disposing the heat radiating apparatus on the lower side of the circuit board instead of the upper side. The integrated circuit apparatus remains on the upper side, and heat is conducted through the circuit board to the heat radiating apparatus on the lower side. This inversion resolves the technical contradiction by freeing up the upper side space for component layout while maintaining cooling performance through the inverted heat dissipation path.
2Temperature
If a heat radiating apparatus is disposed on the upper side of a circuit board above an integrated circuit apparatus, then cooling performance is provided, but the cooling structure increases in size
Solution Approach 1:
By inverting the cooling structure to place the heat radiating apparatus on the lower side of the circuit board, the patent eliminates the need for additional upper-side space that would be required for conventional cooling structures. This reduces the overall size of the cooling structure while maintaining effective heat dissipation through the circuit board's thermal conduction pathways.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances cooling efficiency and provides greater freedom in component placement, enabling improved thermal management without the need for additional upper-side heat radiating apparatuses.
Implementation Method 1
The heat conduction paths are provided in the through holes of the circuit board and connect the electronic component and the heat radiating apparatus
Data Source
AI summary
A heatsink (21) is disposed on a lower surface of a circuit board (10). The circuit board (10) has through holes (h1) that penetrate the circuit board (10) in an area (A) where an integrated circuit apparatus (5) is disposed. Heat conduction paths (11) are provided in the through holes (h1). The heat conduction paths (11) connect the integrated circuit apparatus 5 and the heatsink (21). This structure allows for disposition of a component different from the heatsink (21) on the same side as the integrated circuit apparatus (5), thus ensuring a higher degree of freedom in a component layout.