PCB Heat Dissipation Structure Using Trace-Mounted Flanges
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing PCBs face challenges in efficiently dissipating heat from components with higher heat density and smaller dimensions due to limited airflow, which can lead to unsafe operating conditions.
Innovation Solution
A heat dissipating device featuring arms with flanges, trapezoidal housings, or heat pipes extending from the PCB traces to enhance airflow and facilitate heat dissipation, including spreaders and heat sinks to further reduce component temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If air cooling is used for PCB components, then heat dissipation is achieved, but components with smaller dimensions and higher heat density cannot be effectively cooled
Solution Approach 1:
The patent introduces a three-dimensional heat dissipation structure (housing with openings) that extends vertically from the PCB surface, transforming the traditional two-dimensional planar cooling approach into a three-dimensional volumetric cooling system. This allows air to flow through multiple dimensions around and over the component, significantly enhancing heat dissipation efficiency for high-density components.
Solution Approach 2:
The heat dissipation device is segmented into multiple functional parts: a housing with multiple openings, arms extending from PCB traces, and flanges positioned to direct airflow. This segmentation allows each component to perform a specific function in the heat dissipation process, with air flowing through different paths to maximize cooling effectiveness.
2Ease of manufacture
If conventional PCB layout is maintained, then manufacturing simplicity is preserved, but heat dissipation from high-density components is insufficient
Solution Approach 1:
The patent introduces an intermediary heat dissipation device (housing structure) that is mounted on the existing PCB without requiring fundamental layout changes. This intermediary structure mediates between the existing PCB design and the cooling requirement, allowing air to be directed through controlled paths to specific high-density components while preserving the original PCB trace and component arrangement.
3Productivity
If component dimensions are reduced to increase integration, then PCB density increases, but heat dissipation becomes more difficult
Solution Approach 1:
The heat dissipation device applies local quality enhancement by concentrating cooling resources specifically at high-density component locations. The housing structure with its strategically positioned openings and flanges creates localized high-velocity airflow zones exactly where small, high-heat-density components are mounted, rather than attempting uniform cooling across the entire PCB.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device effectively reduces component temperatures from above 200°C to below 140°C or 100°C, maintaining safe operating conditions without significant layout changes to the PCB.
Implementation Method 1
air flowing from a fan disposed on the PCB interacts with the plurality of flanges causing the plurality of flanges to remove heat from the heat generating component
Implementation Method 2
a heat sink disposed on at least a portion of the heat generating component
Data Source
AI summary
A heat dissipating device configured to dissipate heat generated by heat generating components of a PCB includes: an arm extending from a trace of the PCB proximate a heat generating component; and a plurality of flanges extending from the arm, wherein air flowing from a fan disposed on the PCB interacts with the plurality of flanges causing the plurality of flanges to remove heat from the heat generating component.