PCB Transformer Module Layout for Uniform Current Distribution
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Solution Overview
Problem
Existing transformer designs for low-voltage and high-current applications face issues with non-uniform current distribution due to inconsistencies in impedance across the winding, leading to inefficiencies and increased power consumption, particularly in data processing centers where high power density is required.
Innovation Solution
A transformer module with a multi-layer carrier structure featuring horizontal copper foils and connecting copper foils that surround the magnetic column, ensuring similar equivalent diameters and impedances across the winding, resulting in uniform current distribution and reduced connector losses.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If vertical winding structure is used with PCB wiring layers perpendicular to magnetic column, then manufacturing is simplified, but current distribution becomes non-uniform due to impedance inconsistency
Solution Approach 1:
The patent transitions from vertical winding (current flowing perpendicular to magnetic column) to horizontal winding (current flowing parallel to magnetic column). This dimensional change allows the wiring layers to be parallel to the magnetic column rather than perpendicular, fundamentally altering the current path geometry to achieve uniform impedance distribution while maintaining PCB manufacturing simplicity.
Solution Approach 2:
The patent introduces asymmetric via arrangements where vias are positioned at specific locations (inner side, outer side, intermediate positions) rather than uniformly distributed. This asymmetric placement compensates for the natural impedance gradient in spiral windings by strategically positioning connection points to balance the overall impedance distribution across the winding structure.
2Power
If high switching frequency is used to achieve high power density, then power supply efficiency improves, but transformer losses increase due to non-uniform current distribution
Solution Approach 1:
The patent modifies the geometric parameters of the winding structure, specifically changing from vertical to horizontal orientation and adjusting via positions. These parameter changes result in more uniform current density distribution, which reduces resistive losses (I²R losses) in the transformer windings, thereby decreasing energy losses while maintaining high power density capability.
3Device complexity
If via connections are used to connect perpendicular wiring layers, then multi-layer PCB structure is achieved, but vias become parallel to magnetic column and fail to crosslink magnetic flux effectively
Solution Approach 1:
By changing the wiring layer orientation from perpendicular to parallel relative to the magnetic column, the via connections naturally achieve a different spatial relationship. The vias now connect horizontal layers rather than vertical layers, allowing them to effectively crosslink magnetic flux in the vertical direction while the horizontal current flow maintains uniform impedance distribution.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves more uniform current distribution and reduced power losses, enhancing efficiency and power density in data processing applications by using a multi-layer carrier structure with horizontal copper foils and connecting foils to manage the magnetic flux effectively.
Implementation Method 1
a first winding and a second winding surrounding the magnetic column... the first winding includes at least two horizontal copper foils of the plurality of horizontal copper foils and at least two connecting copper foils of the plurality of connecting copper foils
Data Source
AI summary
A transformer module and a power module are provided. The transformer module includes: a magnetic core, a first winding and a second winding. The magnetic core includes at least one magnetic column at least partially covered by a multi-layer carrier including a plurality of horizontal copper foils and connecting copper foils. Horizontal copper foils are located on horizontal wiring layers, and connecting copper foils are disposed to connect horizontal copper foils. First and second windings surround the magnetic column, and the second winding is located outside the first winding. Both the first and second windings are formed by a horizontal copper foil and a connecting copper foil; two ends of the first winding are electrically connected to first and second surface-mounted pins; two ends of the second winding are electrically connected to third and fourth surface-mounted pins; these pins are disposed on at least one surface of the transformer module.