PCB Trench Sidewall Traces for Signal Integrity
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Solution Overview
Problem
Achieving high signal speeds while maintaining a dense array of signal traces on printed circuit boards (PCBs) is challenging due to impedance mismatch issues in standard plated through hole technology, which requires costly and time-consuming mechanical drilling corrections.
Innovation Solution
The implementation of vertical conductive structures on PCBs, combined with a new pin or ball grid pattern and zig-zag signal assignment, reduces footprint, lowers crosstalk, and improves signal fidelity by using trenches with conductive traces on sidewalls and alternating zig-zag patterns for signal and ground contacts.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If standard plated through hole technology is used, then signal traces can be routed through the PCB, but impedance mismatch occurs and mechanical drilling corrections are required
Solution Approach 1:
The patent extracts the conductive function from traditional plated through holes and relocates it to vertical conductive structures (vias) that are filled with conductive material. This separation allows the via structure to be optimized independently for both electrical performance and manufacturing ease, eliminating the need for mechanical drilling corrections while maintaining signal integrity.
Solution Approach 2:
The patent changes the physical and electrical parameters of the via structure by using vertical conductive structures with specific dimensions, materials, and configurations. These parameter optimizations enable impedance control and signal fidelity improvement without requiring complex mechanical drilling processes.
2Adaptability or versatility
If a dense array of signal traces is implemented, then PCB functionality increases, but crosstalk and signal interference increase
Solution Approach 1:
The patent introduces ground planes and shielding structures as intermediary elements between adjacent signal traces. These intermediary ground structures act as electromagnetic shields that isolate signal paths, preventing crosstalk and interference while allowing dense trace routing to maintain high PCB functionality.
3Reliability
If vertical conductive structures with trenches and sidewall traces are used, then signal fidelity and crosstalk reduction improve, but manufacturing process complexity increases
Solution Approach 1:
The patent transitions from traditional planar PCB routing to three-dimensional vertical conductive structures with sidewall traces. By utilizing the vertical dimension and sidewall surfaces, the design achieves improved signal fidelity and reduced crosstalk while the modular trench structure actually simplifies the overall manufacturing process by eliminating the need for mechanical drilling corrections.
Data Source
AI summary
A PCB having a first surface and a second surface includes a trench extending through the PCB, a plurality of conductive traces on one or more sidewalls of the trench. The plurality of conductive traces extends through the PCB and may be arranged in pairs across from one another along at least a portion of the length of the trench. A first set of conductive contacts are arranged in a first zig-zag pattern around a perimeter of the trench. A second set of conductive contacts are arranged in a second zig-zag pattern around the perimeter of the trench. In some cases, the first and second zig-zag patterns are arranged with respect to one another around the perimeter of the trench in an alternating fashion. A chip package is also disclosed having a pin arrangement that couples to the corresponding arrangement of conductive contacts on the PCB.