PCB Vacuum Feedthrough Sealing via Integrated O-Ring Support
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Solution Overview
Problem
Existing vacuum devices face challenges in effectively sealing the vacuum area from the pressure area, particularly in routing electrical lines, which requires a reliable and gas-tight transition to prevent fluid leakage.
Innovation Solution
A circuit board is used as a separating element between the vacuum and pressure areas, featuring a copper layer support for a sealing element, such as an O-ring, with optimized surface treatment and additional seals to enhance the sealing effect, ensuring a high degree of tightness and preventing fluid leakage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a circuit board is used as a separating element between vacuum and pressure areas, then the sealing effectiveness is improved, but the device complexity increases due to the need for additional sealing elements and surface treatment
Solution Approach 1:
The circuit board is merged with sealing functionality by integrating a sealing element directly onto the circuit board's surface. The support structure for the sealing element is formed as part of the circuit board assembly, combining the electrical connection function with the sealing function in a single integrated component rather than separate elements.
Solution Approach 2:
The circuit board serves multiple functions simultaneously: it provides electrical connections through conductor tracks, acts as a structural separating element between vacuum and pressure areas, and provides sealing functionality through the integrated sealing element. This multi-functionality reduces the need for additional separate components.
2Reliability
If the sealing element is compressed between the circuit board and housing element, then the tightness is improved, but the manufacturing precision requirements increase due to the need for accurate positioning and compression
Solution Approach 1:
The support structure for the sealing element is pre-formed as part of the circuit board assembly before final assembly. This preliminary preparation ensures proper positioning and alignment of the sealing element, reducing the precision requirements during the final compression step with the housing element.
3Ease of manufacture
If the first copper layer is applied directly to the carrier material, then the ease of manufacture is improved, but the sealing length is reduced
Solution Approach 1:
The circuit board structure is segmented into distinct functional layers: the carrier material provides mechanical support, the first copper layer provides electrical conductivity and a base for sealing, and the sealing element provides the actual sealing function. This segmentation allows each layer to be optimized for its specific function while maintaining ease of manufacture through standard PCB fabrication processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a robust and efficient sealing mechanism, minimizing fluid leakage and maintaining a high level of tightness, thus effectively isolating the vacuum area from the pressure area, eliminating the need for additional separating elements.
Implementation Method 1
The sealing element can be compressed in particular between the circuit board, in particular the support, and a housing element of the vacuum pump
Implementation Method 2
The lines have to be routed from the pressure area to the vacuum area, with a transition between the vacuum and pressure areas having to be well sealed
Data Source
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AI summary
The invention relates to a vacuum device, in particular a vacuum pump, comprising a vacuum region and a pressure region and a circuit board that is arranged between the vacuum region and the pressure region and forms a separating element between them.