PCB Copper Vertical Launch Fabrication With Heated Wire Soldering
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Solution Overview
Problem
Conventional printed circuit board (PCB) manufacturing processes are labor-intensive, costly, and limited in producing small feature sizes, which restricts the range of frequencies that RF and electromagnetic circuits can support, and lack automation in creating copper vertical launches (CVLs) for interconnections.
Innovation Solution
An automated apparatus and method for fabricating copper vertical launches (CVLs) within PCBs using a feed mechanism to extrude and cut copper wire, integrate a heated gripper for soldering, and a PCB reflow pre-heater to automate the soldering process, eliminating the need for manual handling and plating.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional PCB manufacturing processes are used, then manufacturing experience and established processes are available, but the processes are labor-intensive, costly, and limited in producing small feature sizes
Solution Approach 1:
The patent replaces conventional mechanical PCB manufacturing processes (lamination, electroplating, masking, etching) with additive manufacturing technology. The system uses a robotic arm with extrusion nozzle to deposit conductive material layer by layer, eliminating the need for traditional mechanical processing equipment and chemical processes. This substitution enables small feature sizes while maintaining high manufacturing speed through automated continuous deposition.
2Productivity
If automated manufacturing is implemented, then productivity and consistency are improved, but device complexity and initial cost increase
Solution Approach 1:
The robotic arm system performs multiple functions within a single automated platform: it positions the extrusion nozzle, deposits conductive material, creates precise patterns, and can adjust deposition parameters. This multi-functional approach consolidates what would otherwise require multiple separate manufacturing machines into one system, improving productivity while managing complexity through integration.
Solution Approach 2:
The system uses computer-aided design (CAD) files to automatically generate manufacturing paths and control the extrusion process without human intervention. The automated path planning and real-time control algorithms enable the system to self-regulate deposition parameters, ensuring consistency and high productivity while reducing the need for complex manual operation procedures.
3Loss of time
If conventional PCB processes are used, then established manufacturing methods are available, but turnaround time is slow and costs are high
Solution Approach 1:
The additive manufacturing process operates continuously without the interruptions required by conventional processes. The robotic arm deposits conductive material in a continuous motion along pre-planned paths, eliminating downtime between lamination, plating, and etching steps. This continuous operation dramatically reduces turnaround time while the automated system maintains manufacturing simplicity through software control.
4Manufacturing precision
If small feature sizes are produced, then high frequency signal support is enabled, but conventional processes lack the ability to achieve these dimensions
Solution Approach 1:
The extrusion nozzle system dynamically adjusts deposition parameters including flow rate, deposition speed, and nozzle-to-substrate distance in real-time. This dynamic control enables the system to produce varying feature sizes and complex geometries with high precision, supporting small signal trace dimensions for high frequency applications while maintaining process flexibility through software-controlled parameter adjustment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the production of compact, low-profile electromagnetic circuits capable of supporting higher frequencies, reduces labor and costs, and increases the reliability and yield of connections, allowing for frequencies up to 300 GHz or more.
Implementation Method 1
integrate a heated gripper for soldering
Implementation Method 2
solder an end of the segment of copper wire to a signal trace of the PCB
Implementation Method 3
a PCB reflow pre-heater mechanism configured to reflow solder once the copper wire is inserted into the hole of the PCB. The pre-heater mechanism further may include a hot plate configured to raise a temperature of the PCB to just under a reflow temperature
Data Source
AI summary
An apparatus for automating the fabrication of a copper vertical launch (CVL) within a printed circuit board (PCB) includes a feed mechanism to feed and extrude copper wire from a spool of copper wire and a wire cutting and gripping mechanism to receive copper wire from the feed mechanism, cut and secure a segment of copper wire, insert the segment of copper wire into a hole formed within the PCB, solder an end of the segment of copper wire to a signal trace of the PCB, and flush cut an opposite end of the segment of the copper wire to a surface of the PCB. The wire cutting and gripping mechanism includes a wire cutter to flush cut the segment of copper wire and an integrated heated gripper device to receive the copper wire from the spool of copper wire and cut and grab a segment from copper wire.