PCB Pass-Through Connector Assembly for Leak-Safe Vessel Interfaces
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Solution Overview
Problem
Existing connector solutions for enclosed vessels are expensive, prone to leaks, and offer limited connector density and flexibility in terms of types and dimensions, making it difficult to effectively communicate data between the interior and exterior of sealed vessels.
Innovation Solution
A pass-through connector assembly using printed circuit board techniques to create conductive pathways between the interior and exterior of vessels, featuring a substrate with signal traces and connectors that form a seal to prevent leaks, allowing for high-density communication through multiple connectors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If custom-made feed-through connectors are used, then connection reliability is improved, but manufacturing cost increases and connector density is limited
Solution Approach 1:
The patent replaces traditional mechanical feed-through connectors with a printed circuit board-based electrical connection system. The PCB serves as the connector substrate, with conductive traces providing electrical pathways through the vessel wall, eliminating the need for complex mechanical sealing mechanisms while maintaining connection reliability.
Solution Approach 2:
The PCB connector assembly serves multiple functions simultaneously: it provides electrical connectivity, structural support, and sealing capability. The single integrated structure replaces multiple separate components (mechanical connectors, seals, and mounting brackets), reducing manufacturing complexity and cost while improving reliability.
2Reliability
If traditional connector solutions are used, then sealing performance is improved, but connector density and design flexibility are limited
Solution Approach 1:
The patent transitions from discrete point-to-point mechanical connectors to a planar two-dimensional PCB surface for connections. This allows multiple connectors to be arranged in high-density patterns across the PCB surface, dramatically increasing connector density while maintaining sealing performance through the integrated gasket design.
Solution Approach 2:
The patent changes the physical state and properties of the connector system by using flexible PCB materials and elastomeric gaskets that can deform to accommodate different vessel wall thicknesses and geometries. This provides design flexibility for various vessel types while maintaining reliable sealing through material property adjustments rather than structural redesign.
3Productivity
If high-density connectors are implemented, then communication capability is improved, but manufacturing complexity increases
Solution Approach 1:
The patent replaces complex mechanical assembly processes with standardized PCB manufacturing techniques. The conductive pathways are created through automated PCB trace deposition and etching processes, and connectors are mounted using standard SMT or through-hole techniques, eliminating the need for manual mechanical assembly even for high-density configurations.
Solution Approach 2:
The patent merges the connector housing, sealing gasket, and PCB substrate into a single integrated assembly. This consolidation reduces the number of manufacturing steps and assembly operations required, as the PCB itself serves as the structural framework rather than a separate component that must be attached to a mechanical housing.
Data Source
AI summary
Systems, methods, and apparatus that employ a connector assembly having a substrate layer with an inner aperture and an outer periphery, and one or more signal traces disposed on the substrate that extend from an inner first location to an outer second location of the apparatus, for communicating data between electronic devices positioned within an interior volume of an enclosed vessel and complementary electronic devices positioned in an ambient environment external to the enclosed vessel. An inner connector is conductively connected the signal traces at the inner first location of each signal trace, and an outer connector is conductively connected to the one or more signal traces at the outer second location of each signal trace. A substantially flat exterior surface extends radially over at least a portion of a region between the respective first locations and the respective second locations.