PCB Via with Conductive Ball for Low Resistance Current Transfer
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Solution Overview
Problem
Current printed circuit board technologies face limitations in efficiently transferring current between layers, leading to high power losses and thermal integrity issues, especially in miniaturized and harsh environments.
Innovation Solution
The use of high-conductivity balls, such as copper or copper alloys, within passages between conductive layers, along with solder for low ohmic contact, creates a secondary electrical path that enhances current transfer while maintaining low resistance and thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If conventional through-hole connections are used between conductive layers, then the structure is simple, but the current transfer capability is limited and power losses are high
Solution Approach 1:
The connection structure is segmented into multiple functional components: conductive material on passage walls forming a first electrical path, and spherical conductors within the passage forming a second electrical path. This segmentation allows each component to contribute differently to current transfer, reducing overall power losses while distributing structural complexity across manageable elements
Solution Approach 2:
The electrical connection utilizes composite construction combining different conductive materials: conductive material deposited on passage walls and spherical conductors (such as copper balls) placed within the passage. This composite approach leverages the advantages of each material to achieve superior current transfer efficiency and reduced power losses compared to conventional single-material connections
2Power
If passage walls are used for current transfer between layers, then the structure is simple, but the current transfer capability is insufficient
Solution Approach 1:
The invention merges two distinct electrical paths into a single connection structure: the first electrical path through conductive material on passage walls and the second electrical path through spherical conductors within the passage. This merging creates a hybrid connection that achieves high current transfer capability while managing structural complexity through integrated design
Solution Approach 2:
The invention transitions from a single-dimensional current transfer path (through passage walls) to a two-dimensional approach by adding spherical conductors as a second path. This dimensional expansion allows current to flow through multiple parallel routes, significantly increasing current transfer capability without proportionally increasing structural complexity
3Volume of moving object
If miniaturization is pursued to reduce package size, then product demands are met, but thermal integrity and current distribution become compromised
Solution Approach 1:
The invention applies local quality enhancement by concentrating high-conductivity materials (spherical conductors and conductive wall material) specifically at the inter-layer connection points where current transfer and heat generation are most critical. This localized quality improvement maintains thermal integrity in miniaturized packages without requiring overall size increase
Solution Approach 2:
The spherical conductors act as intermediary elements between conductive layers, providing both electrical connection and thermal management functions. These intermediaries facilitate efficient current transfer and heat dissipation in miniaturized packages, addressing both electrical and thermal requirements without compromising package size
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables increased current transfer with reduced power losses and improved thermal management, maintaining stress within acceptable levels, and is cost-effective with low complexity in production.
Implementation Method 1
The passage encloses at least one first ball which is electrically conducting and which forms part of a second electrical path between the first and second conductive layers of the printed circuit board
Implementation Method 2
The electrically conductive material is in low ohmic or low resistance contact with the surface of the at least one first ball
Data Source
Figure 1~2
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Figure 6
AI summary
The present invention relates to a printed circuit board arrangement (400) and a method for forming an electrical connection at a printed circuit board. The printed circuit board arrangement comprises a printed circuit board (410) having a first side (411), a second side (412) and an electrical connection (413) electrically connecting a first conductive layer and a second conductive layer (417) of the printed circuit board. The electrical connection (413) comprises a passage (416) extending from an opening in one of the sides of the printed circuit board through the printed circuit board between the first and second layers. Electrically conducting material (414) is formed on the walls (415) of the passage. The electrically conducting material forms a first path electrically connecting the first conductive layer (417) with the second conductive layer (417). At least one first ball 420 is enclosed by the passage. The at least one firstball is electrically conducting and has a diameter which is equal to or smaller than the length and diameter of the passage, wherein the at least one first ball (420) form part of a second electrical path between the first and second conductive layers of the printed circuit board, said second electrical path having a lower resistance than the first path.