Via Hole Formation in Printed Circuit Boards Using Carrier Compression
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Solution Overview
Problem
Existing methods for forming high-density circuit patterns on printed circuit boards, particularly via holes using laser drilling, face challenges in achieving the desired shape due to excessive energy consumption, limiting design freedom and structural benefits.
Innovation Solution
A method involving forming a circuit pattern on a carrier, processing a hole through the carrier, compressing the carrier into an insulation body, removing the carrier, and processing a via hole in the insulation body, followed by filling the via hole with conductive material using electroplating, which allows for precise control and reduced energy usage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If laser drill is used to process via hole with excessive energy, then via hole can be formed, but the desired shape cannot be achieved
Solution Approach 1:
A hole is pre-formed through the carrier before compression, establishing the precise via hole position and shape in advance. This preliminary action eliminates the need for high-energy laser drilling of the insulation body, as the carrier hole template guides subsequent low-energy processing after compression.
Solution Approach 2:
The patent replaces the high-energy laser drilling system with a mechanical compression process. The carrier with pre-formed holes is mechanically compressed into the insulation body, transferring the hole pattern without requiring excessive thermal energy, thus achieving precise via hole formation with reduced energy consumption.
2Productivity
If circuit pattern is formed on surface of insulation body, then high density circuit can be achieved, but various problems are generated
Solution Approach 1:
The circuit pattern is formed on the carrier surface, then the carrier with the circuit pattern is compressed into the insulation body, creating a nested structure where the circuit layer is embedded within the insulation material. This nesting approach achieves high circuit density while maintaining structural reliability through proper embedding.
Solution Approach 2:
The circuit pattern is preliminarily formed on the carrier before compression, allowing precise high-density circuit formation on the carrier surface. This preliminary circuit formation avoids the structural problems that would occur if circuits were formed directly on the insulation body surface, as the carrier provides a stable substrate during the high-density circuit fabrication process.
3Manufacturing precision
If carrier is compressed into insulation body, then circuit pattern can be formed, but carrier removal becomes necessary
Solution Approach 1:
The carrier serves as a temporary support structure that is extracted (removed) after serving its purpose of holding the circuit pattern during compression. This extraction principle allows the carrier to be used for precise circuit pattern formation while acknowledging that an additional removal step is required, but this complexity is necessary to achieve the precision benefits.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables efficient processing of via holes with high design freedom and reduced energy consumption, facilitating the formation of reliable electrical connections between layers in printed circuit boards.
Implementation Method 1
forming a conductive material inside the via hole and on the barrier through electroplating
Data Source
AI summary
Disclosed is a method of manufacturing a printed circuit board. The method of manufacturing a printed circuit board having a via for connecting one layer to another layer can include forming a circuit pattern on one surface of a carrier; processing a hole corresponding to the via on one surface of the carrier; compressing the surface of the carrier into one surface of an insulation body; removing the carrier; processing a via hole on the insulation body, corresponding to a position of the hole; and forming a conductive material in the via hole, to thereby easily process a hole for forming a via and have high design freedom.