PCB Via Formation Using Laser Masking for Alignment

The patent combines multiple via hole forming processes and plating processes into a single integrated process. The via pad structure with through-holes serves as a mask that enables simultaneous formation of multiple via holes across different layers in one laser processing step, followed by a single plating operation that fills all via holes at once. This merging eliminates the need for repeated separate processes for each layer, thereby improving productivity while maintaining via connection reliability through consistent single-step formation.

The via pad structure with through-holes acts as an intermediary mask that enables precise alignment of multiple vias across different layers. This mask structure guides the laser beam to form via holes at exact predetermined positions simultaneously, eliminating alignment errors that would occur with repeated separate processes. The mask serves as a reference that ensures all vias are aligned correctly in a single operation, reducing process complexity while improving via alignment accuracy.

The via pad structure is segmented into multiple through-holes that are distributed across different layers. This segmentation allows the single laser process to form multiple discrete via holes simultaneously, each with its own precise alignment path through the mask. The segmented structure ensures that each via hole receives adequate energy and material deposition during the single plating process, maintaining via connection reliability while achieving high productivity through simultaneous formation of multiple vias.