PCB Heat-Dissipation Via Layout for Slim VCSEL Camera Modules
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Solution Overview
Problem
Conventional semiconductor light source element technologies face challenges in achieving high output and high voltage driving while requiring miniaturization, with existing vertical-cavity surface-emitting laser (VCSEL) packages being thick and having poor heat dissipation, leading to increased signal transmission distance and signal loss.
Innovation Solution
A printed circuit board with a new structure incorporating a substrate with a pad and vertically oriented heat dissipation vias, allowing for efficient heat dissipation and reduced thickness by integrating both light emitting and driving elements on a single substrate, eliminating the need for a separate heat dissipation substrate and adhesive layer, and minimizing signal transmission distance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional VCSEL package structure is used, then light emitting function is achieved, but package thickness is large and heat dissipation is poor
Solution Approach 1:
The patent merges the light emitting element and driving element onto a single substrate, eliminating the need for separate heat dissipation substrate and adhesive layers. This integration reduces package thickness while improving heat dissipation by direct thermal coupling between the light emitting element and the substrate's heat dissipation structure.
Solution Approach 2:
The patent implements heat dissipation vias that extend vertically through the substrate, creating a three-dimensional heat dissipation pathway. This vertical heat dissipation structure reduces thermal resistance without increasing planar package dimensions, effectively addressing the thickness-heat dissipation trade-off.
2Temperature
If separate heat dissipation substrate is used, then heat dissipation is improved, but device complexity and manufacturing steps increase
Solution Approach 1:
The substrate is designed to perform multiple functions simultaneously: it serves as the mounting platform for both light emitting and driving elements, provides electrical connections through integrated vias, and acts as a heat dissipation pathway through vertically extended heat dissipation structures. This multi-functionality eliminates separate heat dissipation substrates and reduces overall device complexity.
Solution Approach 2:
The substrate is engineered as a universal platform that integrates mechanical support, electrical interconnection, and thermal management functions. The heat dissipation vias are positioned to simultaneously provide electrical connectivity and thermal pathways, allowing a single component to fulfill multiple roles that traditionally required separate elements.
3Reliability
If conventional package structure is used, then manufacturing is straightforward, but signal transmission distance is long causing signal loss
Solution Approach 1:
The light emitting element and driving element are integrated on the same substrate with minimal separation distance. The electrical connections between these elements are achieved through short trace paths and integrated vias, significantly reducing signal transmission distance and associated losses compared to conventional packaged structures where elements are mounted separately.
Solution Approach 2:
The substrate is divided into functional regions with precisely positioned vias and traces that create optimized signal pathways. The segmentation of the substrate into distinct mounting areas for light emitting and driving elements, connected by controlled impedance traces, enables short signal paths while maintaining manufacturing feasibility through standardized PCB fabrication processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution results in a slimmer, more reliable light emitting package with improved heat dissipation and reduced signal loss, enabling efficient manufacturing and enhanced product yield by integrating all components on a single substrate.
Implementation Method 1
a heat dissipation via disposed through the substrate in a region vertically overlapping the pad
Data Source
AI summary
A printed circuit board according to an embodiment comprises: a substrate comprising at least two insulating layers; pads arranged on the substrate; heat dissipation vias arranged to pass through the substrate in a region of the substrate which vertically overlaps the pads; and through vias arranged to pass through the substrate in a region of the substrate which does not vertically overlap the pads, wherein each heat dissipation via includes a plurality of via parts which are spaced apart from each other in at least one of the at least two insulating layers, the upper surface of each of the plurality of via parts has a first horizontal width in a first direction that is smaller than a second horizontal width thereof in a second direction different from the first direction, and the plurality of via parts have a surface area corresponding to 10% or greater of the surface area of the pads.