PCB Via Structure with Plating and Metal Paste for 5G Reliability
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Solution Overview
Problem
Conventional printed circuit boards used in 5G communication face challenges with high frequency signal transmission due to inadequate electrical and mechanical characteristics, particularly in antenna modules requiring thick insulating materials and via structures with high defect rates.
Innovation Solution
A printed circuit board design featuring a via structure with a plating layer and metal paste layer, where the plating layer extends to the inner wall of the through hole and includes a land part on the surface, and the metal paste layer fills the remaining space, providing improved electrical conductivity and mechanical reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional via structure is used in a thick insulating material, then the manufacturing process is simple, but the electrical and mechanical characteristics are insufficient and defect rate is high
Solution Approach 1:
The via structure employs a composite construction combining a plating layer (metallic coating on inner wall) and a metal paste layer (conductive filler in resin matrix). This composite approach integrates the advantages of both materials: the plating layer provides excellent electrical conductivity and adhesion to the insulating layer, while the metal paste layer fills the remaining space to provide mechanical strength and structural integrity. This resolves the contradiction by achieving high reliability through material composition rather than simplifying the overall structure.
Solution Approach 2:
The via structure is divided into distinct functional segments: an inner wall plating layer for electrical conduction and adhesion, a metal paste layer for mechanical support and additional conductivity, and separate land parts on the surfaces. This segmentation allows each component to optimize its specific function, thereby achieving high electrical and mechanical characteristics without requiring an overly complex monolithic structure.
2Object-affected harmful factors
If a thick insulating material is used to secure distance between antenna and ground, then electrical insulation is improved, but via connection reliability deteriorates
Solution Approach 1:
The composite via structure with plating layer and metal paste layer maintains reliable electrical and mechanical connection through the thick insulating material. The plating layer ensures continuous electrical path along the via walls, while the metal paste layer provides structural reinforcement that bridges the thick insulation, thereby maintaining connection reliability despite the increased insulation thickness required for antenna grounding separation.
Solution Approach 2:
The via structure applies different material properties at different locations: the plating layer concentrates on the inner wall for electrical conduction, while the metal paste layer fills the bulk space for mechanical support. This local optimization allows the via to penetrate thick insulating material effectively, maintaining both electrical connectivity and mechanical reliability throughout the entire via length.
3Productivity
If conventional via filling method is used, then manufacturing is simple, but defect rate is high
Solution Approach 1:
The plating layer is formed on the inner wall of the via hole before filling with metal paste. This preliminary plating action creates a prepared substrate that improves adhesion of the subsequent metal paste layer, ensuring better bonding and reducing defects such as delamination or void formation. The sequence of operations (plating first, then paste filling) is established as a standard manufacturing process that maintains productivity while significantly reducing defect rates.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances signal transmission and mechanical reliability, reducing defect rates and improving the performance of printed circuit boards and antenna module boards in high-frequency applications.
Implementation Method 1
a plating layer having an inner wall part disposed on an inner wall of the through hole
Implementation Method 2
a metal paste layer formed of metal particles, and filled in the rest of the through hole
Data Source
AI summary
A printed circuit board includes a first insulating layer having a through hole, and a via disposed to fill the through hole and to be extended to at least one surface of the first insulating layer, wherein the via includes a plating layer having an inner wall part disposed on an inner wall of the through hole and a land part extended from the inner wall part and disposed on the at least one surface of the first insulating layer, and a metal paste layer including metal particles, and filled in the rest of the through hole and disposed on the plating layer.