PCB Partial Via Shielding for Voltage Regulator Noise
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Solution Overview
Problem
Circuit boards face challenges in mitigating noise interference from voltage regulators, particularly for high-speed signal traces, which are typically routed far away to minimize noise, leading to increased board size and complexity.
Innovation Solution
Implementing partial metal vias between the voltage regulator and high-speed signal traces on the circuit board to shield against magnetic and electrical noise, allowing the signal traces to be routed closer to the voltage regulator without significant interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If high-speed signal traces are routed far away from the voltage regulator to minimize noise, then noise interference is reduced, but the circuit board size and complexity increase
Solution Approach 1:
The patent introduces an intermediary structure (shielding layer or ground plane) positioned between the voltage regulator and high-speed signal traces. This intermediary acts as a barrier that blocks magnetic and electrical noise from the voltage regulator from coupling into the signal traces, allowing the traces to be routed closer to the regulator without significant interference while maintaining compact board layout
2Object-affected harmful factors
If high-speed signal traces are routed far away from the voltage regulator to minimize noise, then noise interference is reduced, but the circuit board complexity increases
Solution Approach 1:
The shielding layer or ground plane serves as a standardized intermediary component that can be implemented using常规 PCB manufacturing techniques. This approach provides effective noise isolation without requiring complex trace routing patterns, special via structures, or non-standard manufacturing processes, thereby maintaining ease of fabrication while reducing noise interference
3Object-affected harmful factors
If partial metal vias are used to shield against noise, then noise reduction is achieved, but manufacturing complexity increases
Solution Approach 1:
The patent divides the shielding structure into multiple discrete partial metal vias distributed between the voltage regulator and signal traces, rather than requiring a continuous solid shield. This segmentation allows the shielding function to be achieved through standard via structures that can be manufactured using conventional PCB processes, avoiding the need for complex solid copper shields or special manufacturing steps while still providing effective noise reduction
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The partial metal vias effectively reduce noise by up to 22%, enabling high-speed signal traces to be positioned nearer to the voltage regulator, thus reducing the circuit board's form factor and potentially requiring fewer layers.
Implementation Method 1
partial metal vias between the voltage regulator and high-speed signal traces on the circuit board to shield against magnetic and electrical noise
Data Source
AI summary
Technologies for shielding an inductor on a circuit board are disclosed. In the illustrative embodiments, a circuit board has a voltage regulator on top of it and one or more signal traces routed beneath or near the voltage regulator. Partial metal vias are positioned between the signal traces and the voltage regulator. The partial metal vias extend from one trace layer of a circuit board towards another trace layer, but the partial metal vias do not connect the two trace layers. The partial metal vias partially shield the signal traces from noise caused by the voltage regulator.