PCB Via Stub Reduction via Conducting Device Insertion
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The challenge in manufacturing Printed Circuit Boards (PCBs) is to conveniently reduce via stubs, which are difficult to minimize using the back-drilling process due to high operational accuracy requirements.
Innovation Solution
A method involving the acquisition of PCB shape and connection information, assembly of conducting devices, and guiding them into vias to create a conducting PCB without stubs, using metal, nonmetal, or semi-metal conducting devices, and connecting them to form a target PCB.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the back-drilling process is used to reduce via stubs, then the signal reflection is reduced, but the operational accuracy requirements become very high and the process becomes difficult to implement
Solution Approach 1:
Instead of removing via stubs through back-drilling, the patent inverts the approach by filling the vias with conducting devices (metal, semi-metal, or nonmetal) to eliminate the stubs. This replaces a complex subtractive process with a simpler additive process that has lower operational accuracy requirements and is easier to implement.
Solution Approach 2:
The patent changes the fundamental parameter of via treatment from removal (back-drilling) to filling (conduction device insertion). This parameter change transforms the process from one requiring high precision drilling and depth control to one that is more tolerant of variations and easier to control.
2Manufacturing precision
If the back-drilling process is used to reduce via stubs, then the via stub remaining condition is improved, but the operation accuracy requirements increase significantly
Solution Approach 1:
The patent inverts the via stub treatment from removal to filling. Instead of requiring precise back-drilling to remove stubs to a specific depth, the process fills the via with a conducting device, which is less sensitive to precision requirements and achieves the same goal of eliminating via stubs.
Solution Approach 2:
The patent uses consumable conducting devices (metal, semi-metal, or nonmetal) that are inserted into the via to fill it. These devices are simple, inexpensive components that eliminate the need for complex precision drilling operations, making the process more manufacturable.
3Ease of operation
If conducting devices are assembled and guided into vias, then the via stub reduction becomes more convenient, but the device complexity increases
Solution Approach 1:
The patent segments the via filling process into discrete conducting devices that can be independently selected based on the via requirements. These segmented devices (metal, semi-metal, or nonmetal) are assembled and guided into individual vias, making the overall process more manageable and convenient despite the added device complexity.
Solution Approach 2:
The conducting devices act as intermediaries between the via structure and the signal transmission requirements. By introducing these intermediary elements, the patent simplifies the overall via stub reduction process while managing the complexity through standardized device components.
Data Source
AI summary
Disclosed are a method, system and device for manufacturing a printed circuit board, and a computer storage medium. The method comprises: acquiring a printed circuit board to be manufactured which includes a via hole; acquiring shape information of the via hole; acquiring connection information of circuit layers in said printed circuit board; assembling preset conducting devices according to the connection information and the shape information, so as to obtain a target conducting device that matches the connection information and the shape information; guiding the target conducting device into the via hole to obtain a conducting printed circuit board; and connecting the conducting printed circuit board to obtain a target printed circuit board, wherein the types of the preset conducting devices comprise a metal conducting device, a non-metal conducting device and a semi-metal conducting device.