Printed Wiring Board Via Inner Wall Surface Control
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Solution Overview
Problem
Existing printed wiring boards face challenges in transmitting high-speed data due to data degradation caused by the complex inner wall surfaces of via conductor openings, which affect the adhesion and thickness of the seed layer, leading to variations in conductor circuit widths and signal propagation speed.
Innovation Solution
A printed wiring board design featuring a resin insulating layer with first inorganic particles forming the inner wall surfaces of openings and second inorganic particles embedded within, where the shapes of the first inorganic particles differ from the second, allowing for controlled inner wall surfaces that enhance adhesion and reduce seed layer thickness, thereby improving data transmission efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the inner wall surface of via conductor openings is formed with conventional inorganic particles, then adhesion is provided, but the surface becomes complex and causes data degradation
Solution Approach 1:
The patent applies local quality by using spherical inorganic particles specifically at the inner wall surfaces of via conductor openings where adhesion is needed, while using different shaped inorganic particles in the bulk resin insulating layer. This localized application of specific particle shapes ensures adhesion at critical interfaces without creating complex surfaces that would degrade data transmission.
Solution Approach 2:
The patent changes the shape parameter of inorganic particles from irregular/conventional shapes to spherical shapes for the inner wall surface particles. This parameter change creates smooth inner wall surfaces that reduce signal degradation while maintaining adhesion properties through the spherical particle configuration.
2Reliability
If the seed layer thickness is increased to improve adhesion, then connection reliability improves, but conductor circuit width varies and signal propagation speed changes
Solution Approach 1:
The patent uses spherical inorganic particles at the inner wall surfaces to provide localized adhesion enhancement. This allows the seed layer to be applied more uniformly with consistent thickness, as the spherical particles create a more uniform surface topology compared to irregular particles, thereby maintaining conductor circuit width precision while ensuring connection reliability.
3Strength
If complex inner wall surfaces are formed to enhance adhesion, then connection strength improves, but signal propagation speed varies
Solution Approach 1:
The patent changes the shape parameter of inorganic particles to spherical shapes for inner wall surface formation. This parameter change creates smooth surfaces that allow consistent signal propagation speed while maintaining connection strength through the adhesion provided by the spherical particle configuration at the via conductor openings.
Data Source
AI summary
A printed wiring board includes a mounting conductor layer including first and second electrodes, a connection conductor layer including connection wirings such that the connection wirings connect the first and second electrodes, a resin insulating layer formed between the mounting conductor layer and the connection conductor layer and having openings, and connection via conductors formed in the openings of the resin insulating layer and including first and second connection via conductors such that the first connection via conductors electrically connect the first electrodes and the connection wirings and the second connection via conductors electrically connect the second electrodes and the connection wirings. The resin insulating layer includes inorganic particles and resin. The inorganic particles include first inorganic particles forming inner wall surfaces in the openings and second inorganic particles embedded in the resin insulating layer. Shapes of the first inorganic particles are different from shapes of the second inorganic particles.