PCB Vibration for Solder Void Reduction
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Solution Overview
Problem
Existing soldering methods for printed circuit boards often result in voids forming between components and the board, leading to potential failures, especially in high-end applications like aerospace, due to gas inclusions which are not effectively removed by prior methods such as pressure chambers or vibration techniques.
Innovation Solution
Mechanical vibration is applied to the printed circuit board during the soldering process, with a frequency sweep from 0 Hz to 15 kHz, introducing longitudinal waves that compress and decompress the board substrate, expelling gas inclusions from the molten solder and improving thermal transition.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If soldering is performed in a pressure chamber under reduced pressure to remove gas inclusions, then void formation is reduced, but water stored in molecular chains turns into vapor and destroys the plastic housing and delaminates the printed circuit board
Solution Approach 1:
The patent applies frequency sweep vibration (changing the vibration frequency parameter over time from low to high frequencies) to the printed circuit board during soldering. This parameter change creates acoustic waves that effectively expel gas inclusions from the solder joints without requiring reduced pressure, thereby avoiding damage to plastic housings and circuit board delamination while still achieving reliable solder connections with minimal voids
2Manufacturing precision
If soldering is performed under overpressure to compress voids, then void size is reduced, but mechanical stress increases during thermal cycling leading to connection destruction
Solution Approach 1:
The patent uses mechanical vibration applied to the printed circuit board during soldering to actively remove gas inclusions from the solder joints. This vibration creates acoustic waves that propel gas bubbles out of the molten solder, effectively reducing void formation without requiring overpressure. The result is improved solder joint quality without introducing the mechanical stress problems associated with compressed voids
3Device complexity
If vibration is applied to expel gas inclusions without additional vacuum, then device complexity is reduced, but gas inclusion removal is insufficient
Solution Approach 1:
The patent employs periodic vibration with frequency sweep (cycling through different frequencies over time) applied to the printed circuit board during soldering. This periodic mechanical action creates varying acoustic waves that effectively expel gas inclusions from the solder joints. The frequency sweep ensures thorough gas removal across different frequency ranges, achieving reliable void reduction without requiring complex vacuum systems or additional equipment
Solution Approach 2:
The patent replaces complex vacuum-based gas removal systems with a simpler mechanical vibration approach. By applying vibration directly to the printed circuit board, the system uses acoustic waves generated by the vibration itself to expel gas inclusions, eliminating the need for additional vacuum equipment while achieving effective void removal
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method significantly reduces voids in solder joints, enhancing the reliability and performance of soldered connections, particularly in high-performance electronics by effectively expelling gas inclusions and promoting better thermal conductivity.
Implementation Method 1
the printed circuit board is subjected to mechanical vibration. The frequency of the oscillation is changed between a start frequency and an end frequency
Implementation Method 2
The vibrations of the printed circuit board are transmitted directly to the melted solder and, dampened by the molten solder, also to the components arranged above
Data Source
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AI summary
The invention relates to a method for void minimization during the soldering of a printed circuit board (PCB) populated with, in particular, electrical and/or electronic components, wherein, during or after the melting of the solder located between the components and the PCB, the PCB is subjected to a mechanical vibration. The frequency of the vibration is varied between a starting frequency and an ending frequency. According to the invention, the vibration is introduced in one direction of the PCB plane by directly or indirectly coupling at least one actuator to at least one side edge of the PCB, wherein the side edge of the PCB opposite the actuator is supported against a fixed stop.