PCB Voice Coil with Stacked Segmented Circuit Structures
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Solution Overview
Problem
Conventional voice coils have a large thickness, making it challenging to decrease their thickness effectively.
Innovation Solution
A printed circuit board is used as a voice coil, comprising stacked board units with adhering layers and electrically connecting regions, where circuit structures spiral around each other, and holes receive electrically connecting portions to reduce thickness while maintaining functionality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If conventional voice coil structure is used, then electrical connectivity is maintained, but thickness is large
Solution Approach 1:
The voice coil is divided into multiple thin board units (first board unit, second board unit, third board unit, etc.) that are stacked together. Each board unit contains circuit structures that are segmented and distributed across multiple layers, with electrically connecting portions joining them in series. This segmentation allows the voice coil to achieve the required electrical connectivity while reducing overall thickness compared to a conventional single-layer design.
Solution Approach 2:
The circuit structures are extended from a two-dimensional planar layout into a three-dimensional stacked configuration. By arranging circuit structures on multiple board units stacked in the vertical dimension and connecting them through electrically connecting portions, the design achieves equivalent electrical connectivity to a thicker conventional coil while maintaining a compact thin profile in the horizontal plane.
2Length of moving object
If voice coil thickness is decreased, then compactness is improved, but mechanical integrity becomes difficult to maintain
Solution Approach 1:
The voice coil is divided into multiple thin board units (first board unit, second board unit, third board unit, etc.) that are stacked together. Each board unit contains circuit structures that are segmented and distributed across multiple layers, with electrically connecting portions joining them in series. This segmentation allows the voice coil to achieve the required electrical connectivity while reducing overall thickness compared to a conventional single-layer design.
Solution Approach 2:
The voice coil employs a composite structure combining multiple board units with adhering layers. Each board unit provides structural support and electrical connectivity, while the adhering layers bond the board units together, creating a composite assembly that maintains mechanical integrity despite the reduced thickness of individual components.
3Length of moving object
If multiple board units are stacked, then thickness is reduced, but manufacturing complexity increases
Solution Approach 1:
The voice coil is divided into multiple thin board units (first board unit, second board unit, third board unit, etc.) that are stacked together. Each board unit contains circuit structures that are segmented and distributed across multiple layers, with electrically connecting portions joining them in series. This segmentation allows the voice coil to achieve the required electrical connectivity while reducing overall thickness compared to a conventional single-layer design.
Solution Approach 2:
Multiple board units are nested together in a stacked configuration, with each board unit containing circuit structures that fit within the overall voice coil geometry. The electrically connecting portions pass through the board units in a systematic pattern, creating a nested arrangement that achieves the desired electrical connectivity while maintaining a compact form factor.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution allows for a thinner voice coil design while maintaining electrical connectivity and mechanical integrity, potentially improving performance in loudspeaker applications.
Implementation Method 1
A printed circuit board 10 used as a voice coil... each first circuit structure 201 starts in the first electrically connecting region 103, spirals around and closes to the second electrically connecting region 104... When the printed circuit board is powered, electrical current spirals around the second electrically connecting regions 104... for generating a second magnetic field. An acting force is generated between the first magnetic field and the second magnetic field
Data Source
AI summary
A printed circuit board used as a voice coil includes N board units stacked over one another, each board unit having a first electrically connecting region and a second electrically connecting region, all of the first electrically connecting regions being stacked over one another, all of the second electrically connecting regions being stacked over one another, each board unit having a first circuit structure, a base, and a second circuit structure arranged from top to bottom, in each two adjacent board units, the first electrically connecting region of the second circuit structure of an upper board unit being electrically connected in series with the first electrically connecting region of the first circuit structure of a lower board unit, in each board unit, the first circuit structure being electrically connected in series with the second circuit structure in the second electrically connecting region.